ADSP-21375KSZ-2B Analog Devices Inc, ADSP-21375KSZ-2B Datasheet - Page 52

• Manufacturer Part Number: ADSP-21375KSZ-2B
• Description: IC DSP 32BIT 266MHZ 208-MQFP
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21375KSZ-2B

• Interface: DAI, DPI
• Clock Rate: 266MHz
• Non-volatile Memory: ROM (256 kB)
• On-chip Ram: 64kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 208-MQFP, 208-PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21371/ADSP-21375
PACKAGE DIMENSIONS
The ADSP-21371/ADSP-21375 processors are available in a 208-lead RoHS compliant LQFP_EP package.
ORDERING GUIDE
1
2
3
4
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
changes and ordering information.
For a complete list, visit our website at www.analog.com/SHARC
Model
ADSP-21371KSWZ-2A
ADSP-21371KSWZ-2B
ADSP-21371BSWZ-2B
ADSP-21375KSWZ-2B
ADSP-21375BSWZ-2B
A similar part is available for use in specific automotive applications. Contact your local ADI sales office for the automotive data sheet which highlights any specification
Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software.
Referenced temperature is ambient temperature.
Z = RoHS Compliant Part
1.45
1.40
1.35
0.15
0.10
0.05
ROTATED 90° CCW
COPLANARITY
VIEW A
0.08
2
2, 3, 4
2
2, 3
2
1.00 REF
SEATING
PLANE
0.75
0.60
0.45
0.20
0.15
0.09
3.5°
0°
7°
* NOTE:
THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND THERMALLY CONNECTED TO VSS.
THIS SHOULD BE IMPLEMENTED BY SOLDERING THE EXPOSED PAD TO A VSS PCB LAND THAT IS THE SAME SIZE
AS THE EXPOSED PAD. THE VSS PCB LAND SHOULD BE ROBUSTLY CONNECTED TO THE VSS PLANE IN THE PCB
WITH AN ARRAY OF THERMAL VIAS FOR BEST PERFORMANCE.
1.60 MAX
Temperature
Range
0 C to +70 C
0 C to +70 C
-40 C to +85 C
0 C to +70 C
-40 C to +85 C
Figure 40. 208-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
D07170-0-6/08(B)
VIEW A
1
52
1
208
53
PIN 1
30.20
30.00 SQ
29.80
COMPLIANT TO JEDEC STANDARDS MS-026-BJB-HD
Rev. B | Page 52 of 52 | June 2008
On-Chip
SRAM
1M bit
1M bit
1M bit
0.5M bit
0.5M bit
Dimensions shown in millimeters
(PINS DOWN)
TOP VIEW
(SW-208-1)
28.10
28.00 SQ
27.90
ROM
4M bit
4M bit
4M bit
2M bit
2M bit
Operating Voltage
1.2 INT V/3.3 EXT V
1.2 INT V/3.3 EXT V
1.2 INT V/3.3 EXT V
1.2 INT V/3.3 EXT V
1.2 INT V/3.3 EXT V
157
104
156
105
156
105
157
104
LEAD PITCH
BSC
0.50
Package Description
208-Lead LQFP_EP
208-Lead LQFP_EP
208-Lead LQFP_EP
208-Lead LQFP_EP
208-Lead LQFP_EP
BOTTOM VIEW
* EXPOSED
8.712
REF
(PINS UP)
PAD
0.27
0.22
0.17
25.50
REF
208
53
52
1
Package
Option
SW-208-1
SW-208-1
SW-208-1
SW-208-1
SW-208-1
8.890
REF