EP1S25F672I7N Altera, EP1S25F672I7N Datasheet - Page 141
![IC STRATIX FPGA 25K LE 672-FBGA](/photos/6/73/67394/ds-672fbga205-2_0_sml.jpg)
EP1S25F672I7N
Manufacturer Part Number
EP1S25F672I7N
Description
IC STRATIX FPGA 25K LE 672-FBGA
Manufacturer
Altera
Series
Stratix®r
Datasheet
1.EP1S10F780C7.pdf
(276 pages)
Specifications of EP1S25F672I7N
Number Of Logic Elements/cells
25660
Number Of Labs/clbs
2566
Total Ram Bits
1944576
Number Of I /o
473
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
672-FBGA
Family Name
Stratix
Number Of Logic Blocks/elements
25660
# I/os (max)
473
Frequency (max)
420.17MHz
Process Technology
0.13um (CMOS)
Operating Supply Voltage (typ)
1.5V
Logic Cells
25660
Ram Bits
1944576
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
672
Package Type
FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP1S25F672I7N
Manufacturer:
ALTERA
Quantity:
624
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Altera Corporation
July 2005
SSTL-3 Class II
AGP (1× and 2× )
CTT
Table 2–32. I/O Support by Bank (Part 2 of 2)
I/O Standard
Each I/O bank has its own VCCIO pins. A single device can support 1.5-,
1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different standard
independently. Each bank also has dedicated VREF pins to support any
one of the voltage-referenced standards (such as SSTL-3) independently.
Each I/O bank can support multiple standards with the same V
input and output pins. Each bank can support one voltage-referenced
I/O standard. For example, when V
LVTTL, LVCMOS, 3.3-V PCI, and SSTL-3 for inputs and outputs.
Differential On-Chip Termination
Stratix devices provide differential on-chip termination (LVDS I/O
standard) to reduce reflections and maintain signal integrity. Differential
on-chip termination simplifies board design by minimizing the number
of external termination resistors required. Termination can be placed
inside the package, eliminating small stubs that can still lead to
reflections. The internal termination is designed using transistors in the
linear region of operation.
Stratix devices support internal differential termination with a nominal
resistance value of 137.5 Ω for LVDS input receiver buffers. LVPECL
signals require an external termination resistor.
device with differential termination.
Top & Bottom Banks
(3, 4, 7 & 8)
v
v
v
Left & Right Banks
(1, 2, 5 & 6)
v
v
CCIO
Stratix Device Handbook, Volume 1
is 3.3 V, a bank can support
Figure 2–71
Enhanced PLL External
Clock Output Banks
(9, 10, 11 & 12)
Stratix Architecture
v
v
v
shows the
CCIO
2–127
for
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