EP1S25F672I7 Altera, EP1S25F672I7 Datasheet - Page 9
![IC STRATIX FPGA 25K LE 672-FBGA](/photos/6/74/67411/ep1s25f672i7_sml.jpg)
EP1S25F672I7
Manufacturer Part Number
EP1S25F672I7
Description
IC STRATIX FPGA 25K LE 672-FBGA
Manufacturer
Altera
Series
Stratix®r
Datasheet
1.EP1S10F780C7.pdf
(276 pages)
Specifications of EP1S25F672I7
Number Of Logic Elements/cells
25660
Number Of Labs/clbs
2566
Total Ram Bits
1944576
Number Of I /o
473
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
672-FBGA
Family Name
Stratix
Number Of Logic Blocks/elements
25660
# I/os (max)
473
Frequency (max)
420.17MHz
Process Technology
0.13um (CMOS)
Operating Supply Voltage (typ)
1.5V
Logic Cells
25660
Ram Bits
1944576
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
672
Package Type
FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-2087
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP1S25F672I7N
Manufacturer:
ALTERA
Quantity:
624
Introduction
Altera Corporation
July 2005
S51001-3.2
The Stratix
SRAM process, with densities of up to 79,040 logic elements (LEs) and up
to 7.5 Mbits of RAM. Stratix devices offer up to 22 digital signal
processing (DSP) blocks with up to 176 (9-bit × 9-bit) embedded
multipliers, optimized for DSP applications that enable efficient
implementation of high-performance filters and multipliers. Stratix
devices support various I/O standards and also offer a complete clock
management solution with its hierarchical clock structure with up to
420-MHz performance and up to 12 phase-locked loops (PLLs).
The following shows the main sections in the Stratix Device Family Data
Sheet:
Section
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
Logic Array Blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
Logic Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
MultiTrack Interconnect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–14
TriMatrix Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–21
Digital Signal Processing Block . . . . . . . . . . . . . . . . . . . . . . . . 2–52
PLLs & Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–73
I/O Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–104
High-Speed Differential I/O Support. . . . . . . . . . . . . . . . . . 2–130
Power Sequencing & Hot Socketing . . . . . . . . . . . . . . . . . . . 2–140
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support. . . . . . . . . . 3–1
SignalTap II Embedded Logic Analyzer . . . . . . . . . . . . . . . . . 3–5
Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
Temperature Sensing Diode. . . . . . . . . . . . . . . . . . . . . . . . . . . 3–13
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–17
Timing Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–19
Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Device Pin-Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
®
family of FPGAs is based on a 1.5-V, 0.13-µm, all-layer copper
1. Introduction
Page
1–1