XC3S1200E-5FTG256C Xilinx Inc, XC3S1200E-5FTG256C Datasheet - Page 155
XC3S1200E-5FTG256C
Manufacturer Part Number
XC3S1200E-5FTG256C
Description
IC FPGA SPARTAN3E 1200K 256FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S1200E-5FTG256C
Number Of Logic Elements/cells
19512
Number Of Labs/clbs
2168
Total Ram Bits
516096
Number Of I /o
190
Number Of Gates
1200000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Quantity:
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Part Number:
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Table 117: Timing for the Slave Parallel Configuration Mode (Continued)
DS312-3 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
3.
Hold Times
T
T
T
Clock Timing
T
T
F
SMCCD
SMCCCS
SMWCC
CCH
CCL
CCPAR
Symbol
The numbers in this table are based on the operating conditions set forth in
In the Slave Parallel mode, it is necessary to use the BUSY pin when the CCLK frequency exceeds this maximum specification.
Some Xilinx documents refer to Parallel modes as “SelectMAP” modes.
R
The time from the active edge of the CCLK pin to the point when data is last
held at the D0-D7 pins
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the CSO_B pin
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the RDWR_B pin
The High pulse width at the CCLK input pin
The Low pulse width at the CCLK input pin
Frequency of the clock
signal at the CCLK input
pin
No bitstream
compression
With bitstream compression
Description
www.xilinx.com
Not using the BUSY pin
Using the BUSY pin
Table
77.
DC and Switching Characteristics
(2)
All Speed Grades
Min
1.0
0
0
5
5
0
0
0
Max
50
66
20
-
-
-
-
-
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
155
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