XC3S1200E-5FTG256C Xilinx Inc, XC3S1200E-5FTG256C Datasheet - Page 171

• Manufacturer Part Number: XC3S1200E-5FTG256C
• Description: IC FPGA SPARTAN3E 1200K 256FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S1200E-5FTG256C

• Number Of Logic Elements/cells: 19512
• Number Of Labs/clbs: 2168
• Total Ram Bits: 516096
• Number Of I /o: 190
• Number Of Gates: 1200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

User I/Os by Bank
Table 132
distributed between the four I/O banks on the VQ100 pack-
age.
Table 132: User I/Os Per Bank for XC3S100E, XC3S250E, and XC3S500E in the VQ100 Package
Footprint Migration Differences
The production XC3S100E, XC3S250E, and XC3S500E
FPGAs have identical footprints in the VQ100 package.
Designs can migrate between the devices without further
consideration.
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Edge
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
indicates how the 66 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
I/O
15
15
19
17
66
I/O
16
5
6
0
5
www.xilinx.com
INPUT
0
0
0
1
1
All Possible I/O Pins by Type
DUAL
18
21
1
0
2
VREF
1
1
1
1
4
(1)
Pinout Descriptions
CLK
0
24
8
8
8
(2)
(1)
171