MPC8347EVVAJFB Freescale Semiconductor, MPC8347EVVAJFB Datasheet - Page 84

• Manufacturer Part Number: MPC8347EVVAJFB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347EVVAJFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 533 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 533MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Thermal
Table 66
20.2
For the following sections, P
See
84
Junction-to-package natural convection on top
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Junction-to-package natural convection on top
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 5
provides the package thermal characteristics for the 620 29 × 29 mm PBGA of the MPC8347EA.
Thermal Management Information
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
for I/O power dissipation values.
Table 65. Package Thermal Characteristics for TBGA (continued)
Characteristic
Table 66. Package Thermal Characteristics for PBGA
Parameter
D
= (V
DD
× I
DD
) + P
I/O
where P
I/O
is the power dissipation of the I/O drivers.
Symbol
Symbol
ψ
R
R
R
R
R
R
JT
ψ
θJMA
θJMA
θJMA
θJA
θJB
θJC
JT
Value
Value
1
21
15
17
12
6
5
5
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Notes
Notes
1, 2
1, 3
1, 3
1, 3
6
4
5
6