MPC8347EVVAJFB Freescale Semiconductor, MPC8347EVVAJFB Datasheet - Page 89

• Manufacturer Part Number: MPC8347EVVAJFB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347EVVAJFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 533 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 533MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

20.3
When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip.
The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to
the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the
package from the board. Such peeling forces reduce the solder joint lifetime of the package. The
recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive
attachment should attach to painted or plastic surfaces, and its performance should be verified under the
application requirements.
20.3.1
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
where:
Freescale Semiconductor
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
T
T
R
P
J
C
θ
D
Heat Sink Attachment
JC
= junction temperature (°C)
= case temperature of the package (°C)
= power dissipation (W)
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Experimental Determination of the Junction Temperature with a
Heat Sink
= junction-to-case thermal resistance (°C/W)
T
J
= T
C
+ (R
θ
JC
× P
D
)
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800-347-4572
Thermal
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