MPC8347EVVAJFB Freescale Semiconductor, MPC8347EVVAJFB Datasheet - Page 88

IC MPU POWERQUICC II 672-TBGA

MPC8347EVVAJFB

Manufacturer Part Number
MPC8347EVVAJFB
Description
IC MPU POWERQUICC II 672-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheets

Specifications of MPC8347EVVAJFB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
672-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8349E-MITXE
Maximum Clock Frequency
533 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
533MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
672
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
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Manufacturer
Quantity
Price
Part Number:
MPC8347EVVAJFB
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MPC8347EVVAJFB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8347EVVAJFB
Manufacturer:
FREESCALE
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Part Number:
MPC8347EVVAJFB
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Thermal
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
88
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Heat Sink Assuming Thermal Grease
Table 64. Heat Sink and Thermal Resistance of MPC8347E (PBGA) (continued)
Natural convection
Natural convection
Natural convection
Air Flow
603-224-9988
408-567-8082
408-436-8770
818-842-7277
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
Thermal Resistance
29 × 29 mm PBGA
Freescale Semiconductor
11.3
10.1
8.8
8.1
7.5
9.1
7.1
6.5
7.7
6.6
6.9

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