MPC755CPX400LE Freescale Semiconductor, MPC755CPX400LE Datasheet - Page 45

• Manufacturer Part Number: MPC755CPX400LE
• Description: IC MPU PPC 400MHZ 360-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC755CPX400LE

• Processor Type: MPC7xx PowerPC 32-Bit
• Speed: 400MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 360-FCPBGA
• Family Name: MPC7xx
• Device Core: PowerPC
• Device Core Size: 64b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2V
• Operating Supply Voltage (max): 2.1V
• Operating Supply Voltage (min): 1.9V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 360
• Package Type: FCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

The board designer can choose between several types of heat sinks to place on the MPC755. There are
several commercially-available heat sinks for the MPC755 provided by the following vendors:
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
8.8.1
For the exposed-die packaging technology, shown in
paths are as follows:
Figure 26
printed-circuit board.
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the heat sink attach material and the heat sink conduction/convective
thermal resistances are the dominant terms.
Freescale Semiconductor
•
•
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
depicts the primary heat transfer path for a package with an attached heat sink mounted to a
Internal Package Conduction Resistance
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Table
4, the intrinsic conduction thermal resistance
603-224-9988
408-749-7601
800-522-6752
603-635-5102
System Design Information
45