MC8640DTVU1067NE Freescale Semiconductor, MC8640DTVU1067NE Datasheet - Page 112
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MC8640DTVU1067NE
Manufacturer Part Number
MC8640DTVU1067NE
Description
IC MPU DUAL CORE E600 1023FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC8640HX1067NE.pdf
(130 pages)
Specifications of MC8640DTVU1067NE
Processor Type
MPC86xx PowerPC 32-Bit
Speed
1.067GHz
Voltage
0.95V
Mounting Type
Surface Mount
Package / Case
1023-FCCBGA
Family Name
MC8xxx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
1.067GHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
0.95/1.05V
Operating Supply Voltage (max)
1/1.1V
Operating Supply Voltage (min)
0.9/1V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Package Type
CBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC8640DTVU1067NE
Manufacturer:
FREESCALE
Quantity:
1 450
Company:
Part Number:
MC8640DTVU1067NE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Thermal
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
19.2.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where:
112
The Bergquist Company
18930 West 78
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
Corporate Center
PO Box 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
R
R
R
P
i
r
d
j
θJC
θint
θsa
is the die-junction temperature
is the inlet cabinet ambient temperature
is the air temperature rise within the computer cabinet
is the power dissipated by the device
is the heat sink base-to-ambient thermal resistance
is the junction-to-case thermal resistance
is the adhesive or interface material thermal resistance
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
T
j
= T
i
th
+ T
St.
r
+ (R
θJC
+ R
θint
+ R
θsa
) × P
d
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Freescale Semiconductor