KU80960CF33 Intel, KU80960CF33 Datasheet - Page 24

• Manufacturer Part Number: KU80960CF33
• Description: IC MPU I960CF 33MHZ 196-QFP
• Manufacturer: Intel

Specifications of KU80960CF33

• Rohs Status: RoHS non-compliant
• Processor Type: i960
• Features: CF suffix, 32-Bit with DMA, 4K Cache
• Speed: 33MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 196-QFP
• Other names: 803114

80960-40, -33, -25
3.5
24
Table 11. 80960CF PGA Package Thermal Characteristics
Table 12. 80960CF PQFP Package Thermal Characteristics
Stepping Register Information
Upon reset, register g0 contains die stepping information (see
contains ASCII 0; the upper middle byte contains an ASCII C; the lower middle byte contains an
ASCII F. The least significant byte contains the stepping number in ASCII, and g0 retains this
information until it is overwritten by the user program.
number in the least significant byte of register g0 to the die stepping number.
(Case measured as
shown in
(No Heatsink)
(With Heatsink)
(See
NOTES:
as shown in
NOTES:
1. This table applies to 80960CF PGA plugged into socket or soldered directly to board.
2.
3. 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
1. This table applies to 80960CF PQFP soldered directly to board.
2.
Junction-to-Case
Case-to-Ambient
Case-to-Ambient
Junction-to-Case (Case Measured
Case-to-Ambient (No Heatsink)
JA
JA
Parameter
Note
=
=
Figure
JC
JC
3.)
Figure
+
+
Parameter
CA
CA
5.)
5.)
Thermal Resistance — °C/Watt
1.5
(0)
17
13
0
(1.01)
200
1.5
14
9
Airflow — ft./min (m/sec)
Thermal Resistance — °C/Watt
(2.03)
400
1.5
5.5
(0)
19
11
0
5
(3.07)
(0.25)
600
1.5
9
5
50
18
5
(4.06)
800
1.5
7.1
3.9
(0.50)
Airflow — ft./min (m/sec)
Table 13
100
JC
17
5
(5.07)
Figure
1000
1.5
6.6
3.4
(1.01)
contains a cross reference of the
200
15
5
6). The most significant byte
(2.03)
400
12
5
JA
(3.04)
600
10
5
JC
Datasheet
(4.06)
800
5
9