AXH010A0M93-SRZ Lineage Power, AXH010A0M93-SRZ Datasheet - Page 13

• Manufacturer Part Number: AXH010A0M93-SRZ
• Description: DC/DC Converters & Regulators 3-5.5Vin 1.5Vout 10A SMT Remote Sense
• Manufacturer: Lineage Power
• Series: AXH010r

Specifications of AXH010A0M93-SRZ

• Product: Non-Isolated / POL
• Output Power: 15 W
• Input Voltage Range: 3 V to 5.5 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 1.5 V
• Output Current (channel 1): 10 A
• Package / Case Size: SMD
• Output Type: Isolated
• Output Voltage: 1.5 V
• Package / Case: SMD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: CC109106944

TM
Austin Lynx
SIP Non-Isolated dc-dc Power Modules:
Data Sheet
October 1, 2009
3.0 Vdc - 5.5 Vdc Input, 0.9 Vdc - 3.3 Vdc Output, 10 A
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compli-
ant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If addi-
tional information is needed, please consult with your Tyco
Electronics Power System representative for more details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Tyco
Electronics Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
Lineage Power
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