AXH010A0M9-SRZ Lineage Power, AXH010A0M9-SRZ Datasheet - Page 13
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AXH010A0M9-SRZ
Manufacturer Part Number
AXH010A0M9-SRZ
Description
DC/DC Converters & Regulators 3-5.5Vin 1.5Vout 10A SMT Remote Sense
Manufacturer
Lineage Power
Series
AXH010r
Datasheet
1.AXH010A0YZ.pdf
(15 pages)
Specifications of AXH010A0M9-SRZ
Product
Non-Isolated / POL
Output Power
15 W
Input Voltage Range
3 V to 5.5 V
Number Of Outputs
1
Output Voltage (channel 1)
1.5 V
Output Current (channel 1)
10 A
Package / Case Size
SMD
Output Type
Non-Isolated
Output Voltage
1.5 V
Package / Case
SMD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
CC109101417
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AXH010A0M9-SRZ
Manufacturer:
LINEAGE
Quantity:
20 000
TM
Austin Lynx
SIP Non-Isolated dc-dc Power Modules:
Data Sheet
October 1, 2009
3.0 Vdc - 5.5 Vdc Input, 0.9 Vdc - 3.3 Vdc Output, 10 A
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compli-
ant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If addi-
tional information is needed, please consult with your Tyco
Electronics Power System representative for more details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Tyco
Electronics Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
Lineage Power
13