93LC66/P Microchip Technology Inc., 93LC66/P Datasheet - Page 4

• Manufacturer Part Number: 93LC66/P
• Description: 4K, 512 X 8 OR 256 X 16, SER EE
• Manufacturer: Microchip Technology Inc.

Specifications of 93LC66/P

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±10 μA
• Current, Operating: 100 μA (Read), 3 mA (Write)
• Current, Output, Leakage: ±10
• Data Retention: >200 yrs.
• Density: 4K
• Interface: 3-Wire
• Memory Type: Serial EEPROM
• Organization: 512×8/256×16
• Package Type: PDIP
• Temperature, Operating: -40 to +125 °C
• Time, Access: 500 ns
• Time, Address Setup: 50
• Voltage, Esd: ≥4 kV
• Voltage, Input, High: 3.5 V
• Voltage, Input, Low: 0.8, 0.5 V
• Voltage, Output, High: 2.3 V
• Voltage, Output, Low: 0.3 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

93LC46/56/66
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS21712B-page 12
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
eB
E1
E
Dimension Limits
§
Units
2
1
eB
A2
A1
E1
B1
D
n
p
A
E
L
B
c
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
 2004 Microchip Technology Inc.
NOM
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
10.92
L
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
4.32
15
15