93LC66/P Microchip Technology Inc., 93LC66/P Datasheet - Page 5

• Manufacturer Part Number: 93LC66/P
• Description: 4K, 512 X 8 OR 256 X 16, SER EE
• Manufacturer: Microchip Technology Inc.

Specifications of 93LC66/P

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±10 μA
• Current, Operating: 100 μA (Read), 3 mA (Write)
• Current, Output, Leakage: ±10
• Data Retention: >200 yrs.
• Density: 4K
• Interface: 3-Wire
• Memory Type: Serial EEPROM
• Organization: 512×8/256×16
• Package Type: PDIP
• Temperature, Operating: -40 to +125 °C
• Time, Access: 500 ns
• Time, Address Setup: 50
• Voltage, Esd: ≥4 kV
• Voltage, Input, High: 3.5 V
• Voltage, Input, Low: 0.8, 0.5 V
• Voltage, Output, High: 2.3 V
• Voltage, Output, Low: 0.3 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2004 Microchip Technology Inc.
Device
Temperature
Range
Package
PART NO.
Device
Temperature
93LC46:
93LC46X: 1K 2.5V Microwire Serial EEPROM in
93LC46T: 1K 2.5V Microwire Serial EEPROM
93LC46XT: 1K 2.5V Microwire Serial EEPROM
93LC56:
93LC56X: 2K 2.5V Microwire Serial EEPROM in
93LC56T: 2K 2.5V Microwire Serial EEPROM
93LC56XT:2K 2.5V Microwire Serial EEPROM
93LC66:
93LC66X: 4K 2.5V Microwire Serial EEPROM in
93LC66T: 4K 2.5V Microwire Serial EEPROM
93LC66XT: 4K 2.5V Microwire Serial EEPROM
I
P
SN
Range
X
= -40 C to +85 C
=
=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
1K 2.5V Microwire Serial EEPROM
2K 2.5V Microwire Serial EEPROM
4K 2.5V Microwire Serial EEPROM
alternate pinouts (SN package only)
(Tape and Reel)
(Tape and Reel)
alternate pinouts (SN package only)
(Tape and Reel)
(Tape and Reel)
alternate pinouts (SN package only)
(Tape and Reel)
(Tape and Reel)
Package
/XX
Pattern
XXX
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
j)
k)
l)
93LC46-I/P: 1K, 128x8 or 64x16 Serial
EEPROM, PDIP package
93LC46-I/SN: 1K, 128x8 or 64x16 Serial
EEPROM, SOIC package
93LC46T-I/SN: 1K, 128x8 or 64x16
Serial EEPROM, SOIC package, tape
and reel
93LC46X-I/SN: 1K, 128x8 or 64x16
Serial EEPROM, Rotated SOIC package
93LC56-I/P: 2K, 256x8 or 128x16 Serial
EEPROM, PDIP package
93LC56-I/SN: 2K, 256x8 or 128x16
Serial EEPROM, SOIC package
93LC56T-I/SN: 2K, 256x8 or 128x16
Serial EEPROM, SOIC package, tape
and reel
93LC56X-I/SN: 2K, 256x8 or 128x16
Serial EEPROM, Rotated SOIC package
93LC66-I/P: 4K, 512x8 or 256x16 Serial
EEPROM, PDIP package
93LC66-I/SN: 4K, 512x8 or 256x16
Serial EEPROM, SOIC package
93LC66T-I/SN: 4K, 512x8 or 256x16
Serial EEPROM, SOIC package, tape
and reel
93LC66X-I/SN: 4K, 512x8 or 256x16
Serial EEPROM, Rotated SOIC package
93LC46/56/66
.
DS21712B-page 17