MCP23S17-E/SP Microchip Technology Inc., MCP23S17-E/SP Datasheet - Page 39

• Manufacturer Part Number: MCP23S17-E/SP
• Description: I/O Port Expander, 16-Bit, SPI I'face, SDIP-28
• Manufacturer: Microchip Technology Inc.
• Type: Programmable Peripheral Interfacer

Specifications of MCP23S17-E/SP

• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
D
A
E
K
e
b
L
E2
MCP23017/MCP23S17
1
2
MIN
0.80
0.00
3.65
3.65
0.23
0.50
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
DS21952B-page 39
b
K
e