MCP23S17-E/SP Microchip Technology Inc., MCP23S17-E/SP Datasheet - Page 41

• Manufacturer Part Number: MCP23S17-E/SP
• Description: I/O Port Expander, 16-Bit, SPI I'face, SDIP-28
• Manufacturer: Microchip Technology Inc.
• Type: Programmable Peripheral Interfacer

Specifications of MCP23S17-E/SP

• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
Units
A2
A1
E1
L1
N
D
A
E
e
L
c
φ
b
A2
MCP23017/MCP23S17
E
MIN
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
10.50
MAX
2.00
1.85
8.20
5.60
0.95
0.25
0.38
8°
–
DS21952B-page 41
φ
L