PIC16F684-I/ML Microchip Technology Inc., PIC16F684-I/ML Datasheet - Page 139

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PIC16F684-I/ML

Manufacturer Part Number
PIC16F684-I/ML
Description
MCU, 8-Bit, 2KW Flash, 128 RAM, 12 I/O, QFN-16
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC16F684-I/ML

A/d Inputs
8-Channel, 10-Bit
Comparators
2
Cpu Speed
5 MIPS
Eeprom Memory
256 Bytes
Input Output
12
Memory Type
Flash
Number Of Bits
8
Package Type
16-pin QFN
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F684-I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
120
15.6
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
JA
JC
J
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
100.4
69.8
85.0
46.3
32.5
31.0
31.7
Typ
150
2.6
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
PIC16F684
DD
A
Conditions
)/θ
OL
+ P
x V
) + Σ (I
JA
DD
I
/
O
DS41202F-page 137
OH
* (V
DD
- V
OH
))

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