PIC16F684-I/ML Microchip Technology Inc., PIC16F684-I/ML Datasheet - Page 178

• Manufacturer Part Number: PIC16F684-I/ML
• Description: MCU, 8-Bit, 2KW Flash, 128 RAM, 12 I/O, QFN-16
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F684-I/ML

• A/d Inputs: 8-Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 256 Bytes
• Input Output: 12
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 16-pin QFN
• Programmable Memory: 3.5K Bytes
• Ram Size: 128 Bytes
• Speed: 20 MHz
• Timers: 2-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC16F684
DS41202F-page 176
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
0.45
0.19
MIN
4.90
0.09
0°
–
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
–
–
–
–
–
Microchip Technology Drawing C04-087B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
8°
φ
L