ISL3178AEMBZ-T Intersil, ISL3178AEMBZ-T Datasheet - Page 12

• Manufacturer Part Number: ISL3178AEMBZ-T
• Description: TXRX ESD 3.3V RS485/422 8-SOIC
• Manufacturer: Intersil
• Type: Transceiverr

Specifications of ISL3178AEMBZ-T

• Number Of Drivers/receivers: 1/1
• Protocol: RS422, RS485
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Die Characteristics
DIE DIMENSIONS
Interface Materials
GLASSIVATION
TOP METALLIZATION:
SUBSTRATE
BACKSIDE FINISH
Assembly Related Information
SUBSTRATE POTENTIAL
Additional Information
WORST CASE CURRENT DENSITY
PROCESS
TRANSISTOR COUNT
PAD OPENING SIZE
WAFER SIZE
TRANSISTOR COUNT
Silicon/Polysilicon/Oxide
Thickness: 19 mils
1295µm x 1350µm
Sandwich TEOS & Nitride
Type: Al with 0.5% Cu
Thickness: 28kA
N/A
GND (powered up)
N/A
Si GateBiCMOS
535
90µm x 90µm
200mm (~8 inch)
535
12
ISL3178AE
PAD #
TABLE 2. BOND PAD FUNCTION AND COORDINATES
10
12
11
1
2
3
4
5
6
7
8
9
A (half duplex)
A (full duplex)
FUNCTION
GND2
GND1
V
RO
RE
DE
DI
Y
Z
B
CC
398.55
508.55
931.70
916.25
517.55
921.2
892.1
887.2
(µm)
54.5
54.5
54.5
53.0
X
1163.55
May 6, 2009
1086.2
318.35
382.45
830.35
1075.2
800.2
476.8
694.4
(µm)
59.7
59.7
70.5
FN6887.1
Y