AD8391ARZ Analog Devices Inc, AD8391ARZ Datasheet - Page 4

IC LINE DRVR XDSL PWR DWN 8SOIC

AD8391ARZ

Manufacturer Part Number
AD8391ARZ
Description
IC LINE DRVR XDSL PWR DWN 8SOIC
Manufacturer
Analog Devices Inc
Type
Driverr
Datasheet

Specifications of AD8391ARZ

Number Of Drivers/receivers
2/0
Protocol
xDSL
Voltage - Supply
3 V ~ 12 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
For Use With
AD8391AR-EVAL - BOARD EVAL FOR AD8391
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AD8391
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation
Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . .
Logic Voltage, PWDN . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Short-Circuit Duration
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Operating Temperature Range . . . . . . . . . . . –40 C to +85 C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 C
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8391 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Specification is for device on a 4-layer board in free air at 85 C: 8-Lead SOIC
package:
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . 650 mW
. . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curve
JA
= 100 C/W.
Model
AD8391AR
AD8391AR–REEL
AD8391AR–REEL7
AD8391AR–EVAL
2
1
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
ORDERING GUIDE
V
V
S
S
–4–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8391 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for a plastic encapsu-
lated device is determined by the glass transition temperature of
the plastic, approximately 150 C. Temporarily exceeding this
limit may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package.
To ensure proper operation, it is necessary to observe the maxi-
mum power derating curve.
Package
Description
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
Evaluation Board
Figure 2. Plot of Maximum Power Dissipation
vs. Temperature
2.0
1.5
1.0
0.5
0
–50
–40 –30 –20 –10 0
AMBIENT TEMPERATURE – C
Package
Option
R-8
R-8
R-8
10
20 30
8-LEAD SOIC PACKAGE
40 50
T
60 70
J
= 150 C
80 90
REV. A

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