STM32L152C8U6 STMicroelectronics, STM32L152C8U6 Datasheet - Page 105
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STM32L152C8U6
Manufacturer Part Number
STM32L152C8U6
Description
Microcontrollers (MCU) 32-Bit Arm Cortex M3 64kb LCD Ultralow
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32L152-EVAL.pdf
(107 pages)
Specifications of STM32L152C8U6
Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
32MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
37
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 16x12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-UFQFN Exposed Pad
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32L152C8U6
Manufacturer:
STM
Quantity:
200
Company:
Part Number:
STM32L152C8U6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32L151xx, STM32L152xx
9
Revision history
Table 65.
16-Dec-2010
25-Feb-2011
on
01-Oct-2010
02-Jul-2010
Date
Document revision history
Revision
1
2
3
4
Initial release.
Removed 5 V tolerance (FT) from PA3, PB0 and PC3 in
STM32L15xxx pin definitions on page 30
Updated
characteristics on page 46
Updated
Added
Updated
Modified consumptions on page 1 and in
modes on page 13
LED_SEG8 removed on PB6
Updated
VFQFPN48 replaced by UFQFPN48
Features: updated value of Low-power sleep.
Section 3.3.2: Power supply
Table 4: STM32L15xxx pin
reset) and alternate function for OSC_IN and OSC_OUT pins; modified
footnote 5; added footnote to OSC32_IN and OSC32_OUT pins; C1
and D1 removed on PD0 and PD1 pins (TFBGA64 column).
Section 3.11: DAC (digital-to-analog
Table 6: Voltage
Table 7: Current
and negative injection.
Table 11: Embedded reset and power control block
updated typ and max values for T
Table 13: Current consumption in Run mode, code with data
processing running from
(16 MHz), Range 3.
Table 14: Current consumption in Run mode, code with data
processing running from
(16 MHz), Range 3.
Table 15: Current consumption in Sleep
clock source (16 MHz), Range 3 for both RAM and Flash; changed
units.
Table 16: Current consumption in Low power run
parameter and max value of I
Table 17: Current consumption in Low power sleep
symbol, parameter, and max value of I
Table 18: Typical and maximum current consumptions in Stop
updated values for I
clock (32.768 kHz), regulator in LP mode, HSI and HSE OFF (no
independent watchdog).
Doc ID 17659 Rev 4
Table 48: ADC clock frequency on page 84
Table 11: Embedded reset and power control block
Table 12: Embedded internal reference voltage on page 48
Table 49: ADC characteristics on page 84
Section 6: Electrical characteristics on page 41
characteristics: updated footnote 3 regarding I
characteristics: updated footnote 4 regarding positive
DD (Stop with RTC)
Flash: removed values for HSI clock source
RAM: removed values for HSI clock source
definitions: modified main function (after
supervisor: updated note.
DD
Changes
Max (LP Run).
RSTTEMPO
- RTC clocked by LSE external
converter): updated bullet list.
DD
mode: removed values for HSI
Section 3.1: Low power
Max (LP Sleep).
(V
DD
mode: updated
rising, BOR enabled).
characteristics:
mode: updated
Revision history
Table 4:
mode:
INJ(PIN)
105/107
.