TDA5051AT/C1,518 NXP Semiconductors, TDA5051AT/C1,518 Datasheet
![IC HOME AUTOMATION MODEM 16SOIC](/photos/6/64/66482/16-soic_sot162-1_sml.jpg)
TDA5051AT/C1,518
Specifications of TDA5051AT/C1,518
TDA5051ATD-T
TDA5051ATD-T
Related parts for TDA5051AT/C1,518
TDA5051AT/C1,518 Summary of contents
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TDA5051A Home automation modem Rev. 5 — 13 January 2011 1. General description The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 baud or 1200 baud data rate. ...
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... NXP Semiconductors 4. Quick reference data Table 1. Quick reference data Symbol Parameter V supply voltage DD I total supply current DD(tot) f carrier frequency cr f oscillator frequency osc V output carrier signal (RMS value) o(rms) V input signal (RMS value) i(rms) THD total harmonic distortion on CISPR16 load ...
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... NXP Semiconductors 6. Block diagram DGND 5 1 DATA_IN 4 CLK_OUT 7 OSC1 OSCILLATOR 8 OSC2 2 DIGITAL DATA_OUT DEMODULATOR 16 TEST1 Fig 1. Block diagram TDA5051A Product data sheet AGND V V DDA DDD modulated 6 carrier ROM D/A DAC clock 10 CONTROL LOGIC filter clock ÷ 2 DIGITAL BAND-PASS FILTER 8 H PEAK ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration for SO16 7.2 Pin description Table 3. Symbol DATA_IN DATA_OUT V DDD CLK_OUT DGND SCANTEST OSC1 OSC2 APGND TX_OUT V DDAP AGND V DDA RX_IN PD TEST1 TDA5051A Product data sheet DATA_IN 1 2 DATA_OUT 3 V DDD CLK_OUT ...
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... NXP Semiconductors 8. Functional description Both transmission and reception stages are controlled either by the master clock of the microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on ...
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... NXP Semiconductors Remark: In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to − long as DATA_IN is LOW. Then, the old gain setting is automatically restored. ...
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... NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol osc T stg T amb T j 10. Characteristics Table 5. Characteristics ± − DDD DDA amb Symbol Parameter Supply V supply voltage DD I total supply current DD(tot) I total analog + digital ...
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... NXP Semiconductors Table 5. Characteristics …continued ± − DDD DDA amb Symbol Parameter OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when using an external clock generator) V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage ...
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... NXP Semiconductors Table 5. Characteristics …continued ± − DDD DDA amb Symbol Parameter Reception mode V analog input signal i(rms) (RMS value level at pin RX_IN I Z RX_IN input impedance i R AGC range AGC t AGC time constant c(AGC) t demodulation delay d(dem)(su) set-up time t demodulation delay ...
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... NXP Semiconductors V o(rms) (dBV) −20 −40 −60 −80 −100 Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBμV (RMS); marker at −5 dBV (RMS) = 115 dBμV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBμV (RMS). Fig 3. Carrier spectrum − ...
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... NXP Semiconductors 11. Timing 11.1 Configuration for clock For parameter description, see Fig 6. External clock For parameter description, see Fig 7. Typical configuration for on-chip clock circuit Table 6. Oscillator frequency f 6.080 MHz to 9.504 MHz Table 7. Symbol f osc f CLKOUT W(DI)(min) TDA5051A Product data sheet ...
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... NXP Semiconductors Table 7. Symbol t W(burst)(min) t c(AGC) t su(demod) t h(demod) (1) t (2) t (3) t Fig 8. Relationship between DATA_IN and TX_OUT (see Table don’t care Fig 9. Pulse shape characteristics TDA5051A Product data sheet Calculation of parameters depending on the clock frequency Parameter minimum burst time of V ...
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... NXP Semiconductors 11.2 Timing diagrams CLK_OUT DATA_IN TX_OUT (1) DATA_IN is an edge-sensitive input and must be HIGH before starting a transmission. Fig 10. Timing diagram during power-up in Transmission mode CLK_OUT RX_IN DATA_OUT Fig 11. Timing diagram during power-up in Reception mode PD DATA_IN TX_OUT Fig 12. Power-down sequence in Transmission mode ...
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... NXP Semiconductors RX_IN DATA_OUT Fig 13. Power-down sequence in Reception mode RX_IN DATA_OUT I DD(RX DD(PD) Fig 14. Power saving by dynamic control of power-down TDA5051A Product data sheet PD t d(dem)(su) DATA_OUT delayed active(min All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 TDA5051A ...
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... NXP Semiconductors 12. Application information + Fig 15. Application diagram without power line insulation TDA5051A Product data sheet 250 V (AC) T 630 mA max + 78L05 2 470 μF (16 V) 100 μ (16 V) DATA_IN 1 DATA_OUT 2 MICRO- CONTROLLER CLK_OUT OSC1 2.2 MΩ XTAL 7.3728 MHz 115.2 kHz for XTAL = 7.3728 MHz standard crystal. ...
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... NXP Semiconductors 20 G (dB) −20 −60 −100 a. Gain (Ω Input impedance f Main features of the coupling network rejection > 80 dB; anti-aliasing for the digital filter > the sampling frequency ( 95 kHz to 148.5 kHz band. Fig 16. Gain (a) and input impedance (b) of the coupling network TDA5051A Product data sheet ...
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... NXP Semiconductors with coupling network μ nF. Fig 17. Output voltage as a function of line impedance + Fig 18. Application diagram with power line insulation TDA5051A Product data sheet 130 V o (dBμV) 120 110 100 1 250 V (AC) T 630 mA max + 78L05 2 470 μF (16 V) 100 μ (16 V) ...
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... NXP Semiconductors +5 V CONTROLLER f Fig 19. Application diagram without power line insulation, with improved sensitivity (68 dBμV typ.) TDA5051A Product data sheet 250 V (AC) T 630 mA max 78L05 2 470 μF (16 V) 100 μ (16 V) DATA_IN 1 DATA_OUT 2 MICRO- TDA5051A CLK_OUT OSC1 OSC2 2.2 MΩ ...
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... NXP Semiconductors +5 V MICRO- CONTROLLER f Fig 20. Application diagram with power line insulation, with improved sensitivity (68 dBμV typ.) TDA5051A Product data sheet 250 V (AC) T 630 mA max 78L05 2 470 μF (16 V) 100 μ (16 V) DATA_IN 1 DATA_OUT 2 TDA5051A CLK_OUT OSC1 OSC2 2.2 MΩ ...
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... NXP Semiconductors 13. Test information Fig 21. Test set-up for measuring demodulation delay OSC1 OSC1 OSC2 OSC2 (1) (1) (1) Square wave TTL signal 300 Hz, duty factor = 50 % for measuring signal bandwidth (see (2) DATA_IN + LOW for measuring total harmonic distortion (see (3) Tuned for f (4) The CISPR16 network provides a −6 dB attenuation. ...
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... NXP Semiconductors DATA_IN (1) See Fig 23. Test set-up for measuring Bit Error Rate (BER) TDA5051A Product data sheet TX_OUT in 10 TDA5051A 12, AGND, DGND, APGND OSC1 OSC2 XTAL = 8.48 MHz OSC1 OSC2 7 8 RX_IN out 14 TDA5051A (to be tested) 12, AGND, DGND, APGND DATA_OUT DATA_IN ...
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... NXP Semiconductors 14. Package outline SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...
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... NXP Semiconductors temperature MSL: Moisture Sensitivity Level Fig 25. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 11. Acronym ADC AGC ASK CMOS DAC HF I NRZ RMS ...
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... NXP Semiconductors 18. Revision history Table 12. Revision history Document ID Release date TDA5051A v.5 20110113 • Modifications: Table 1 “Quick reference – Min value changed from −10 °C to −50 °C – Max value changed from +80 °C to +100 °C • Table 4 “Limiting – Min value changed from −10 °C to −50 °C – ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 Transmission mode . . . . . . . . . . . . . . . . . . . . . 5 8.2 Reception mode . . . . . . . . . . . . . . . . . . . . . . . . 6 8.3 Data format . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 ...