MAX9924UAUB+ Maxim Integrated Products, MAX9924UAUB+ Datasheet - Page 2

• Manufacturer Part Number: MAX9924UAUB+
• Description: IC SENSOR INTERFACE VARI 10MSOP
• Manufacturer: Maxim Integrated Products
• Type: Sensor Interfacer

Specifications of MAX9924UAUB+

• Input Type: Differential
• Output Type: Logic
• Interface: Differential
• Current - Supply: 5mA
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Variable Reluctance Sensor Interfaces with
Differential Input and Adaptive Peak Threshold
ABSOLUTE MAXIMUM RATINGS
V
All Other Pins..............................................-0.3V to (V
Current into IN+, IN-, IN_+, IN_-.......................................±40mA
Current into All Other Pins ................................................±20mA
Output Short-Circuit (OUT_, OUT) to GND.............................10s
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
50pF. T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
µMAX
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
2
POWER SUPPLY
Operating Supply Range
Supply Current
Power-On Time
INPUT OPERATIONAL AMPLIFIER (MAX9925/MAX9927)
Input Voltage Range
Input Offset Voltage
Input Bias Current
Input Offset Current
Common-Mode Rejection Ratio
Power-Supply Rejection Ratio
Output Voltage Low
Output Voltage High
Recovery Time from Saturation
Gain-Bandwidth Product
Slew Rate
Charge-Pump Frequency
CC
CC
10-Pin µMAX (derate 8.8mW/°C above +70°C) ........707.3mW
16-Pin QSOP (derate 9.6mW/°C above +70°C)........771.5mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
_______________________________________________________________________________________
to GND .............................................................-0.3V to + 6V
= 5V, V
A
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
= T
PARAMETER
MIN
GND
to T
= 0V, MAX9925/MAX9927 gain setting = 1V/V, Mode A1, V
MAX
, unless otherwise noted. Typical values are at T
A
= +70°C) (Note 1)
SYMBOL
IN+, IN-
I
V
OFFSET
CMRR
PSRR
GBW
I
OS-OA
JC
P
V
V
t
BIAS
V
I
f
SAT
SR
CC
CP
CC
ON
OH
OL
) ................42°C/W
JA
) ......113.1°C/W
CC
(Note 3)
MAX9924/MAX9925
MAX9926/MAX9927
V
~ 1µs
Guaranteed by CMRR
Temperature drift
(Note 4)
(Note 4)
MAX9925
MAX9927
I
I
To 1% of the actual V
saturates
From V
OL
OH
+ 0.3V)
CC
= 1mA
= -1mA
> V
CM
UVLO
= 0 to V
CONDITIONS
= 4.1V, step time for V
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
QSOP
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
A
CC
= +25°C.) (Note 2)
OUT
BIAS
after output
= 2.5V, V
CC
PULLUP
V
0.050
MIN
4.5
CC
75
88
77
0
= 5V, R
-
TYP
0.05
102
105
2.6
4.7
0.5
0.1
1.2
1.4
2.3
1.3
30
94
PULLUP
JC
) ................37°C/W
JA
0.050
MAX
= 1kΩ, C
V
150
5.5
) ......103.7°C/W
10
CC
5
5
3
6
2
UNITS
COUT
µV/°C
MHz
MHz
V/µs
mA
mV
nA
nA
dB
dB
µs
µs
V
V
V
V
=