LTC2871IFE#PBF Linear Technology, LTC2871IFE#PBF Datasheet - Page 32

• Manufacturer Part Number: LTC2871IFE#PBF
• Description: IC, RS232-RS485 TXRX, 200MBPS, 5.5V, TSSOP-38
• Manufacturer: Linear Technology

Specifications of LTC2871IFE#PBF

• Device Type: Transceiver
• No. Of Drivers: 2
• Supply Voltage Range: 3V To 5.5V
• Driver Case Style: TSSOP
• No. Of Pins: 38
• Operating Temperature Range: -40°C To +85°C
• Rohs Compliant: Yes
• Ic Interface Type: RS232, RS485

LTC2870/LTC2871
32
PACKAGE DESCRIPTION
6.60 ±0.10
4.50 ±0.10
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
RECOMMENDED SOLDER PAD LAYOUT
(.0035 – .0079)
0.09 – 0.20
SEE NOTE 4
(.187)
MILLIMETERS
4.75
(INCHES)
(.169 – .177)
4.30 – 4.50*
(.020 – .030)
0.50 – 0.75
0.65 BSC
0.45 ±0.05
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
28-Lead Plastic TSSOP (4.4mm)
(.108)
4. RECOMMENDED MINIMUM PCB METAL SIZE
(Reference LTC DWG # 05-08-1663)
2.74
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FOR EXPOSED PAD ATTACHMENT
1.05 ±0.10
0.25
REF
Exposed Pad Variation EB
0° – 8°
PAD HEAT SINK
ON BOTTOM OF
FE Package
EXPOSED
PACKAGE
(.0256)
0.65
BSC
28 2726 25 24 23
1
(.0077 – .0118)
0.195 – 0.30
2
TYP
3 4 5 6 7 8 9 10 11 12 13 14
(.378 – .386)
9.60 – 9.80*
(.187)
22 21
4.75
20
19
18 17
16
15
(.002 – .006)
0.05 – 0.15
FE28 (EB) TSSOP 0204
(.047)
(.108)
1.20
MAX
2.74
(.252)
6.40
BSC
28701f