LTC2871IFE#PBF Linear Technology, LTC2871IFE#PBF Datasheet - Page 35

IC, RS232-RS485 TXRX, 200MBPS, 5.5V, TSSOP-38

LTC2871IFE#PBF

Manufacturer Part Number
LTC2871IFE#PBF
Description
IC, RS232-RS485 TXRX, 200MBPS, 5.5V, TSSOP-38
Manufacturer
Linear Technology
Datasheet

Specifications of LTC2871IFE#PBF

Device Type
Transceiver
No. Of Drivers
2
Supply Voltage Range
3V To 5.5V
Driver Case Style
TSSOP
No. Of Pins
38
Operating Temperature Range
-40°C To +85°C
Rohs Compliant
Yes
Ic Interface Type
RS232, RS485

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC2871IFE#PBF
Manufacturer:
Linear Technology
Quantity:
135
PACKAGE DESCRIPTION
7.00 0.10
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5.50 0.05
OUTLINE M0-220 VARIATION WHKD
4.10 0.05
PIN 1
TOP MARK
(SEE NOTE 6)
3.00 REF
5.00 0.10
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.15 ± 0.05
RECOMMENDED SOLDER PAD LAYOUT
(Reference LTC DWG # 05-08-1701 Rev C)
38-Lead Plastic QFN (5mm × 7mm)
5.15 ± 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
0.25 0.05
6.10 0.05
7.50 0.05
0.75 0.05
5.5 REF
UHF Package
5.50 REF
0.00 – 0.05
0.200 REF
0.50 BSC
0.25 0.05
BOTTOM VIEW—EXPOSED PAD
0.70 0.05
5.15 ± 0.10
PACKAGE
OUTLINE
LTC2870/LTC2871
3.15 ± 0.10
3.00 REF
R = 0.125
TYP
37
38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 45 CHAMFER
R = 0.10
TYP
0.40 0.10
1
2
(UH) QFN REF C 1107
35
28701f

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