PX1011B-EL1/G,551 NXP Semiconductors, PX1011B-EL1/G,551 Datasheet - Page 3

• Manufacturer Part Number: PX1011B-EL1/G,551
• Description: IC PCI-EXPRESS X1 PHY 81-LFBGA
• Manufacturer: NXP Semiconductors

Specifications of PX1011B-EL1/G,551

• Package / Case: 81-LFBGA
• Applications: PCI Express MAX to PCI Express PHY
• Interface: JTAG
• Voltage - Supply: 1.2 V
• Mounting Type: Surface Mount
• Input Voltage Range (max): 0.31 V
• Maximum Operating Temperature: + 70 C
• Maximum Power Dissipation: 300 mW
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.2 V
• Supply Current (max): 28 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4715; 935282113551; PX1011B-EL1/G-S; PX1011B-EL1/G-S

NXP Semiconductors
4. Ordering information
Table 2.
[1]
5. Marking
PX1011B
Product data sheet
Type number
PX1011B-EL1/G
PX1011B-EL1/N
PX1011BI-EL1/G
PX1011B-EL1/Q900
PX1011B-EL1/Q900 is AEC-Q100 compliant. Contact [e-mail] for PPAP.
Ordering information
[1]
Solder process
Pb-free (SnAgCu
solder ball compound)
SnPb solder ball
compound
Pb-free (SnAgCu
solder ball compound)
Pb-free (SnAgCu
solder ball compound)
Table 3.
Table 4.
[1]
Line
A
B
C
Line
A
B
C
Industrial temperature range.
Marking
PX1011B-EL1/N
xxxxxxx
2PNyyww
Marking
PX1011B-EL1/G
PX1011BI-EL1/G
PX1011B-EL1/Q
xxxxxxx
2PGyyww
Leaded package marking
Lead-free package marking
All information provided in this document is subject to legal disclaimers.
Package
Name
LFBGA81 plastic low profile fine-pitch ball grid array
LFBGA81 plastic low profile fine-pitch ball grid array
LFBGA81 plastic low profile fine-pitch ball grid array
LFBGA81 plastic low profile fine-pitch ball grid array
Rev. 5 — 18 April 2011
[1]
[1]
Description
full basic type number
diffusion lot number
manufacturing code:
Description
full basic type number
diffusion lot number
manufacturing code:
Description
package; 81 balls; body 9 × 9 × 1.05 mm
package; 81 balls; body 9 × 9 × 1.05 mm
package; 81 balls; body 9 × 9 × 1.05 mm
package; 81 balls; body 9 × 9 × 1.05 mm
2 = diffusion site
P = assembly site
N = leaded
yy = year code
ww = week code
2 = diffusion site
P = assembly site
G = lead-free
yy = year code
ww = week code
PCI Express stand-alone X1 PHY
PX1011B
© NXP B.V. 2011. All rights reserved.
Version
SOT643-1
SOT643-1
SOT643-1
SOT643-1
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