UJA1069TW24/5V0/C, NXP Semiconductors, UJA1069TW24/5V0/C, Datasheet - Page 3

• Manufacturer Part Number: UJA1069TW24/5V0/C,
• Description: IC LIN FAIL-SAFE 24HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1069TW24/5V0/C,

• Applications: *
• Interface: *
• Voltage - Supply: *
• Package / Case: 24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935285413512

NXP Semiconductors
3. Ordering information
Table 1.
UJA1069_4
Product data sheet
Type number
UJA1069TW
UJA1069TW24
Ordering information
2.4 Fail-safe features
Package
Name
HTSSOP32
HTSSOP24
I
I
I
I
I
I
I
I
I
I
I
I
I
Safe and predictable behavior under all conditions
Programmable fail-safe coded window and time-out watchdog with on-chip oscillator,
guaranteeing autonomous fail-safe system supervision
Fail-safe coded 16-bit SPI interface for the microcontroller
Global enable pin for the control of safety-critical hardware
Detection and detailed reporting of failures:
Rigorous error handling based on diagnostics
Supply failure early warning allows critical data to be stored
23 bits of access-protected RAM is available e.g. for logging of cyclic problems
Reporting in a single SPI message; no assembly of multiple SPI frames needed
Limp-home output signal for activating application hardware in case system enters
Fail-safe mode (e.g. for switching on warning lights)
Fail-safe coded activation of Software development mode and Flash mode
Unique SPI readable device type identification
Software-initiated system reset
N
N
N
N
N
N
N
On-chip oscillator failure and watchdog alerts
Battery and voltage regulator undervoltages
LIN-bus failures (short-circuits)
TXDL and RXDL clamping situations and short-circuits
Clamped or open reset line
SPI message errors
Overtemperature warning
Description
plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
plastic thermal enhanced thin shrink small outline package; 24 leads;
body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
Rev. 04 — 28 October 2009
LIN fail-safe system basis chip
UJA1069
© NXP B.V. 2009. All rights reserved.
Version
SOT549-1
SOT864-1
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