CC-9P-V526UJ-S Digi International, CC-9P-V526UJ-S Datasheet - Page 4
CC-9P-V526UJ-S
Manufacturer Part Number
CC-9P-V526UJ-S
Description
MOD 9P 32MB SDRAM 8MB FLASH
Manufacturer
Digi International
Series
-r
Datasheet
1.CC-9P-V526UJ-EA.pdf
(130 pages)
Specifications of CC-9P-V526UJ-S
Module/board Type
Core Module
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
Networking
- Current page: 4 of 130
- Download datasheet (7Mb)
Customer support .............................................................................. 3
C h a p t e r 1 : A b o u t t h e M o d u l e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Module variant ................................................................................13
Pinout legend: Type ..........................................................................14
X1 pinout .......................................................................................14
X2 pinout .......................................................................................18
Default module CPU configuration .........................................................26
Identification of the module ................................................................27
Module pin configuration ....................................................................27
Clock frequencies .............................................................................29
Changing the CPU speed .....................................................................29
Chip select memory map ....................................................................31
www.digiembedded.com
Features and functionality ............................................................12
Module pinout ..........................................................................14
Configuration pins — CPU .............................................................26
Configuration pins — Module .........................................................27
Clock generation .......................................................................29
Boot process ............................................................................30
Chip selects .............................................................................31
SDRAM banks ............................................................................32
NAND Flash Memory ....................................................................32
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Contents
4
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