BD6722FS-E2 Rohm Semiconductor, BD6722FS-E2 Datasheet - Page 4

• Manufacturer Part Number: BD6722FS-E2
• Description: IC MTR DVR DC BRUSHLESS SSOP-A16
• Manufacturer: Rohm Semiconductor
• Series: -r

Specifications of BD6722FS-E2

• Applications: Fan Motor Driver, Brushless (BLDC)
• Evaluation Tools: *
• Number Of Outputs: 1
• Current - Output: -
• Voltage - Load: 4.5 V ~ 17 V
• Voltage - Supply: 4.5 V ~ 17 V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: *
• Package / Case: *
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

〇CAUTIONS ON USE
10) Testing on application boards
11) GND wiring pattern
12) Capacitor between output and GND
13) IC terminal input
1) Absolute maximum ratings
2) Connecting the power supply connector backward
3) Power supply line
4) GND potential
5) Thermal design
6) Inter-pin shorts and mounting errors
7) Actions in strong electromagnetic field
8) ASO
9) Thermal shut down circuit
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated
values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An
external direction diode can be added.
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor
between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem
before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low
temperatures)
The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal
do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect
below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition,
environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error
or if pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis width
of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always
discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a
jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution
when transporting or storing the IC.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single
ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large
currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external
components, either.
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that
the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND
below 100uF.
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is
applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual
interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic
element is actuated.
REV. D
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