UJA1065TW/5V0,518 NXP Semiconductors, UJA1065TW/5V0,518 Datasheet - Page 68
![IC CAN/LIN FAIL-SAFE 32HTSSOP](/photos/6/94/69422/uja1065_hq_sml.jpg)
UJA1065TW/5V0,518
Manufacturer Part Number
UJA1065TW/5V0,518
Description
IC CAN/LIN FAIL-SAFE 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1065TW3V3CT.pdf
(76 pages)
Specifications of UJA1065TW/5V0,518
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Applications
Networking
Interface
CAN, LIN
Voltage - Supply
5.5 V ~ 52 V
Mounting Type
Surface Mount
Product
Controller Area Network (CAN)
Number Of Transceivers
1
Data Rate
20 Kbps
Supply Voltage (max)
27 V, 52 V
Supply Voltage (min)
5.5 V
Supply Current (max)
10 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4374-2
935281292518
UJA1065TW/5V0-T
UJA1065TW/5V0-T
935281292518
UJA1065TW/5V0-T
UJA1065TW/5V0-T
NXP Semiconductors
12. Package outline
Fig 29. Package outline SOT549-1 (HTSSOP32)
UJA1065_7
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 07 — 25 February 2010
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
High-speed CAN/LIN fail-safe system basis chip
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1065
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
68 of 76
A