SC003A0A91 Lineage Power, SC003A0A91 Datasheet - Page 16

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SC003A0A91

Manufacturer Part Number
SC003A0A91
Description
DC/DC Converters & Regulators TH 3A, IN 24V OUT 5V, NEGATIVE
Manufacturer
Lineage Power
Datasheet

Specifications of SC003A0A91

Lead Free Status / Rohs Status
No RoHS Version Available
Other names
108988283
Data Sheet
December 12, 2008
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, T
specifications is shown in Figure 49. For reliable
operation this temperature should not exceed 120
Figure 49. T
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (T
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
EMC Considerations
Figure 50 shows a suggested configuration to meet the
conducted emission limits of EN55022 Class B.
Notes: C1, C2, C3 and C6 are low impedance SMT
ceramics. C4 is a low impedance polymer film type
(Paktron CS4). Common Mode inductor is Pulse
Engineering type P0354 1.17mH.
LINEAGE
POWER
ref
Temperature Measurement Location.
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
ref
used in the
Tref
A
) for natural
o
C.
SW/SC001/003 Series DC-DC Power Module:
Figure 50. Suggested Configuration for EN55022
Class B.
Figure 51. EMC signature using above filter,
SW003A0A.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
The SW/SC power module series are low profile in order
to be used in fine pitch system card architectures. As
such, component clearance between the bottom of the
power module and the mounting board is limited. Avoid
placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
For additional layout guide-lines, refer to the
FLTR100V10 data sheet.
C1
0.68uF
100K
90
80
70
60
50
40
30
20
10
Frequency(Hz)
EN 55022 Class B Conducted Average dBuV
C2
0.68uF
CMC 1.17mH
Pulse P0354
500K
C3
0.68uF
1M
L1 10uH
Polymer
C4
4.7uF
C5 N/F
C6 2 x 56nF
5M
VI(+)
VI(-)
SW003A0A
5V @ 3A
10M
Vo +
Vo -
16
30M

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