SI4709-B-GM Silicon Laboratories Inc, SI4709-B-GM Datasheet - Page 38
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SI4709-B-GM
Manufacturer Part Number
SI4709-B-GM
Description
IC FM RADIO TUNER 20-QFN
Manufacturer
Silicon Laboratories Inc
Series
-r
Datasheet
1.SI4709-B-GM.pdf
(42 pages)
Specifications of SI4709-B-GM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI4709-B-GMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Si4708/09-B
38
Notes: General
Notes: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
Symbol
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All pads are to be non-solder mask defined (NSMD). Clearance between the solder
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C
GD
D2
E2
D
E
e
f
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
be used to assure good solder paste release.
A 1.18x1.18 mm square aperture should be used for the center pad. This
provides approximately 70% solder paste coverage on the pad, which is
optimum to assure correct component stand-off.
specification for Small Body Components.
1.35
1.35
1.95
Min
Table 10. PCB Land Pattern Dimensions
Millimeters
2.60 REF
0.50 BSC
2.60 REF
2.00 BSC
Max
1.45
1.45
—
Confidential Rev. 1.4
Symbol
GE
ZD
ZE
W
X
Y
1.95
Min
—
—
—
—
Millimeters
0.65 REF
Max
0.30
0.30
3.25
3.25
—