ADG709BRU Analog Devices Inc, ADG709BRU Datasheet - Page 20

• Manufacturer Part Number: ADG709BRU
• Description: IC MULTIPLEXER DUAL 4X1 16TSSOP
• Manufacturer: Analog Devices Inc
• Type: Analog Multiplexerr

Specifications of ADG709BRU

• Rohs Status: RoHS non-compliant
• Function: Multiplexer
• Circuit: 2 x 4:1
• On-state Resistance: 4.5 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V, ±2.5 V
• Current - Supply: 0.001µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Package: 16TSSOP
• Maximum On Resistance: 11@3V Ohm
• Maximum Propagation Delay Bus To Bus: 14(Typ)@5V|18(Typ)@3V|14(Typ)@±2.5V ns
• Maximum High Level Output Current: 30 mA
• Multiplexer Architecture: 4:1
• Number Of Channels Per Chip: 1
• Maximum Turn-off Time: 8(Typ)@3V ns
• Maximum Turn-on Time: 18(Typ)@3V ns
• Power Supply Type: Single|Dual

ADG708/ADG709
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG708BRU
ADG708BRU-REEL
ADG708BRU-REEL7
ADG708BRUZ
ADG708BRUZ-REEL
ADG708BRUZ-REEL7
ADG708CRU
ADG708CRU-REEL
ADG708CRU-REEL7
ADG708CRUZ
ADG708CRUZ-REEL
ADG708CRUZ-REEL7
ADG709BRU
ADG709BRU-REEL
ADG709BRU-REEL7
ADG709BRUZ
ADG709BRUZ-REEL
ADG709BRUZ-REEL7
ADG709CRU
ADG709CRU-REEL
ADG709CRU-REEL7
ADG709CRUZ
ADG709CRUZ-REEL
ADG709CRUZ-REEL7
1
©2000–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
0.15
0.05
D00041-0-4/09(C)
4.50
4.40
4.30
PIN 1
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
0.30
0.19
9
8
Rev. C | Page 20 of 20
1.20
MAX
SEATING
PLANE
6.40
BSC
(RU-16)
0.20
0.09
8°
0°
0.75
0.60
0.45
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16