A8296SESTR-T Allegro Microsystems Inc, A8296SESTR-T Datasheet - Page 18

• Manufacturer Part Number: A8296SESTR-T
• Description: IC REG LNB SGL SUPPLY 16-QFN
• Manufacturer: Allegro Microsystems Inc

Specifications of A8296SESTR-T

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

A8296
mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
Copyright ©2008-2010, Allegro MicroSystems, Inc.
The products described here are manufactured under one or more U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per-
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
I
DiSEqC™ is a trademark of Eutelsat S.A.
2
C™ is a trademark of Philips Semiconductors.
17X
0.08
D
0.40±0.10
0.25
C
Single LNB Supply and Control Voltage Regulator
+0.05
–0.07
2
1
1
2
16
For the latest version of this document, visit our website:
16
0.50
A
3.00 ±0.15
1.70
B
Package ES 16-Pin MLP/QFN
www.allegromicro.com
3.00 ±0.15
1.70
0.75 ±0.05
SEATING
PLANE
C
A Terminal #1 mark area
B Exposed thermal pad (reference only, terminal #1
C Reference land pattern layout (reference IPC7351
D Coplanarity includes exposed thermal pad and terminals
For reference only, not for tooling use (reference JEDEC MO-220WEED)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
identifier appearance at supplier discretion)
QFN50P300X300X80-17W4M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
0.90
C
1
PCB Layout Reference View
16
3.10
1.70
0.30
115 Northeast Cutoff
1.508.853.5000; www.allegromicro.com
Allegro MicroSystems, Inc.
Worcester, Massachusetts 01615-0036 U.S.A.
0.50
1.70
3.10
18