IS61LV256-12J ISSI, Integrated Silicon Solution Inc, IS61LV256-12J Datasheet - Page 9

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IS61LV256-12J

Manufacturer Part Number
IS61LV256-12J
Description
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS61LV256-12J

Density
256Kb
Access Time (max)
12ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3.3V
Address Bus
15b
Package Type
SOJ
Operating Temp Range
0C to 70C
Number Of Ports
1
Supply Current
100mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.63V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
28
Word Size
8b
Number Of Words
32K
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS61LV256-12J
Manufacturer:
ICSI
Quantity:
2 490
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IS61LV256-12J
Manufacturer:
MT
Quantity:
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IS61LV256-12J
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ISSI
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20 000
Company:
Part Number:
IS61LV256-12J
Quantity:
847
Part Number:
IS61LV256-12JI
Manufacturer:
SANKEN
Quantity:
206
PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic SOJ
Package Code: J
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. D
02/25/03
Sym.
N0.
Leads
A
A1
A2
b
B
C
D
E
E1
E2
e
N
1
e
17.02
Min. Typ. Max.
2.41
0.41
0.66
0.20
8.26
7.49
6.27
0.64
MILLIMETERS
1.27 BSC
24/26
D
17.27
3.56
2.67
0.51
0.81
0.25
8.76
7.75
7.29
b
B
0.025
0.095
0.016
0.026
0.008
0.670
0.325
0.247
Min. Typ. Max.
0.295
0.050 BSC
INCHES
A
E1
A1
— 0.140
0.105
0.020
0.032
0.010
0.680
0.345
0.305
0.287
1-800-379-4774
E
SEATING PLANE
Notes:
1. Controlling dimension: inches, unless otherwise
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
4. Formed leads shall be planar with respect to one
specified.
protrusions and
the package
another within 0.004 inches at the seating plane.
E2
.
should be measured from the bottom of
A2
ISSI
C
®

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