LH28F800BJHE-PBTL90 Sharp Electronics, LH28F800BJHE-PBTL90 Datasheet - Page 5

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LH28F800BJHE-PBTL90

Manufacturer Part Number
LH28F800BJHE-PBTL90
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F800BJHE-PBTL90

Cell Type
NOR
Density
8Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
20/19Bit
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
1M/512K
Supply Current
30mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
■ Low Voltage Operation
■ OTP(One Time Program) Block
■ User-Configurable ×8 or ×16 Operation
■ High-Performance Read Access Time
■ Operating Temperature
■ Low Power Management
■ Optimized Array Blocking Architecture
■ Extended Cycling Capability
The product is a high-density, low-cost, nonvolatile, read/write storage solution for a wide range of applications.
The product can operate at V
realize battery life and suits for cellular phone application.
Its Boot, Parameter and Main-blocked architecture, low voltage and extended cycling provide for highly flexible component
suitable for portable terminals and personal computers. Its enhanced suspend capabilities provide for an ideal solution for code
+ data storage applications.
For secure code storage applications, such as networking, where code is either directly executed out of flash or downloaded to
DRAM, the product offers four levels of protection: absolute protection with V
locking or flexible software block locking. These alternatives give designers ultimate control of their code security needs.
The product is manufactured on SHARP’s 0.25µm ETOX
48-lead TSOP, ideal for board constrained applications.
*ETOX is a trademark of Intel Corporation.
sharp
V
3963 word + 4 word Program only array
90ns(V
-40°C to +85°C
Typ. 2µA (V
Automatic Power Savings Mode Decreases I
Static Mode
Typ. 120µA (V
Read Current
Two 4K-word (8K-byte) Boot Blocks
Six 4K-word (8K-byte) Parameter Blocks
Fifteen 32K-word (64K-byte) Main Blocks
Bottom Boot Location
Minimum 100,000 Block Erase Cycles
CC
=V
CC
CCW
=2.7V-3.6V)
=2.7V-3.6V Single Voltage
CC
CC
=3.0V) Standby Current
=3.0V, T
8M-BIT ( 512Kbit ×16 / 1Mbit ×8 )
CC
=2.7V-3.6V and V
A
Boot Block Flash MEMORY
=+25°C, f=32kHz)
LH28F800BJHE-PBTL90
CCR
CCW
LHF80J05
in
=2.7V-3.6V or 11.7V-12.3V. Its low voltage operation capability
TM*
process technology. It come in industry-standard package: the
■ Enhanced Automated Suspend Options
■ Enhanced Data Protection Features
■ Automated Block Erase, Full Chip Erase,
■ SRAM-Compatible Write Interface
■ Industry-Standard Packaging
■ ETOX
■ CMOS Process (P-type silicon substrate)
■ Not designed or rated as radiation hardened
Word/Byte Write and Lock-Bit Configuration
Word/Byte Write Suspend to Read
Block Erase Suspend to Word/Byte Write
Block Erase Suspend to Read
Absolute Protection with V
Block Erase, Full Chip Erase, Word/Byte Write and
Lock-Bit Configuration Lockout during Power
Transitions
Block Locking with Command and WP#
Permanent Locking
Command User Interface (CUI)
Status Register (SR)
48-Lead TSOP
TM*
Nonvolatile Flash Technology
CCW
≤V
CCWLK
, selective hardware block
CCW
≤V
CCWLK
Rev. 1.27
2

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