TE28F008B3TA90 Intel, TE28F008B3TA90 Datasheet - Page 63

• Manufacturer Part Number: TE28F008B3TA90
• Manufacturer: Intel

Specifications of TE28F008B3TA90

• Cell Type: NOR
• Density: 8Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Top
• Address Bus: 19b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 512K
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 40
• Lead Free Status / Rohs Status: Not Compliant

14.0
Datasheet
NOTES:
1. Call the Intel Literature Center at [phone] to request Intel documentation. International customers must contact their
2. Visit the Intel home page at http://www.Intel.com or http://developer.intel.com for technical documentation and tools.
3. For the most current information on Intel
Contact your Intel Representative
local Intel or distribution sales office.
memory, visit http://developer.intel.com/design/flash/
Order Number
297948
292199
292200
297874
Note 2
Additional Information
Intel
AP-641 Achieving Low Power with the 3 Volt Advanced Boot Block Flash Memory
AP-642 Designing for Upgrade to the 3 Volt Advanced Boot Block Flash Memory
3 Volt Advanced Boot Block Algorithms (‘C’ and assembly)
Intel
IFDI Interactive: Play with Intel
http://developer.intel.com/design/flash/swtools

®

Advanced Boot Block Flash Memory Family Specification Update
Flash Data Integrator (IFDI) Software Developer’s Kit
Advanced Boot Block Flash memory and Intel
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
®
Flash Data Integrator on Your PC
Document/Tool

Advanced+ Boot Block Flash
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