CY7C1360B-200AC Cypress Semiconductor Corp, CY7C1360B-200AC Datasheet - Page 24

• Manufacturer Part Number: CY7C1360B-200AC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1360B-200AC

• Density: 9Mb
• Access Time (max): 3ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 200MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 18b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 1
• Supply Current: 220mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.465V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 256K
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05291 Rev. *C
AC Test Loads and Waveforms
Note:
Capacitance
15. Tested initially and after any design or process change that may affect these parameters.
Thermal Resistance
C
C
C
IN
CLK
I/O
OUTPUT
OUTPUT
Parameter
Parameter
3.3V I/O Test Load
2.5V I/O Test Load
Θ
Θ
JA
JC
Z
Z
[15]
0
0
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
= 50Ω
= 50Ω
Description
(a)
(a)
V
Description
V
[15]
L
L
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
3.3V
2.5V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA / JESD51.
INCLUDING
INCLUDING
T
V
V
A
DD
DDQ
JIG AND
JIG AND
SCOPE
SCOPE
= 25°C, f = 1 MHz,
Test Conditions
5 pF
5 pF
= 3.3V.
Test Conditions
= 2.5V
(b)
(b)
R = 317Ω
R = 1667Ω
R = 351Ω
R =1538Ω
Package
V
Package
TQFP
GND
GND
DD
TQFP
V
5
5
5
DD
25
9
≤ 1 ns
≤ 1 ns
10%
10%
Package
Package
BGA
ALL INPUT PULSES
ALL INPUT PULSES
BGA
5
5
7
25
6
90%
90%
(c)
(c)
Package
CY7C1360B
CY7C1362B
Package
fBGA
fBGA
5
5
7
27
6
Page 24 of 34
90%
90%
10%
10%
°C/W
°C/W
≤ 1 ns
≤ 1 ns
Unit
Unit
pF
pF
pF