DSP56002FC66 Freescale Semiconductor, DSP56002FC66 Datasheet - Page 79
![](/photos/31/36/313697/132pin_pqfp_sml.jpg)
DSP56002FC66
Manufacturer Part Number
DSP56002FC66
Description
Manufacturer
Freescale Semiconductor
Datasheet
1.DSP56002FC66.pdf
(110 pages)
Specifications of DSP56002FC66
Device Core Size
24b
Architecture
Harvard
Format
Fixed Point
Clock Freq (max)
66MHz
Mips
33
Device Input Clock Speed
66MHz
Ram Size
3KB
Program Memory Size
1.5KB
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
132
Package Type
PQFP
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSP56002FC66
Manufacturer:
MOTOROLA
Quantity:
5 530
Company:
Part Number:
DSP56002FC66
Manufacturer:
MOTOROLA
Quantity:
6 250
Company:
Part Number:
DSP56002FC66
Manufacturer:
MOTOROLA
Quantity:
591
Part Number:
DSP56002FC66
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Company:
Part Number:
DSP56002FC661H72G
Manufacturer:
AD
Quantity:
92
MOTOROLA
VIEW AB
C
C2
L
Figure 3-3 132-Pin Plastic Quad Flat Pack (PQFP) Mechanical Information
132X
18
50
C1
0.008
D
17
51
0.012
0.002 N
0.010
M
0.016
A1
S1
T
H
T
1
L-M
Freescale Semiconductor, Inc.
H
L-M
2X
L-M
SECTION AA-AA
For More Information On This Product,
L-M
N
J
N
N
132X
A
0.008
N
U
4X
S
4X 33 TIPS
D1
4X
M
N
Go to: www.freescale.com
J1
T
PIN 1
IDENT
AA
L-M
DSP56002/D, Rev. 3
R R1
K
117
N
83
W
H
CASE 831A-02
116
84
AA
M
K1
ISSUE C
P1
T
0.004 T
P
GAGE
PLANE
0.002 L-M
SEATING
PLANE
V1
V
132X
B1
2X
B
NOTES:
1. DIMENSIONING AND TOLERANCING
2. DIMENSIONS IN INCHES.
3. DIMENSIONS A, B, J, AND P DO NOT
4. DATUM PLANE H IS LOCATED AT THE
5. DATUMS L, M, AND N TO BE
6. DIMENSIONS S AND V TO BE
7. DIMENSIONS A, B, J, AND P TO BE
8. DIMENSION F DOES NOT INCLUDE
PER ASME Y14.5M, 1982.
INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION
FOR DIMENSIONS A AND B IS 0.007,
FOR DIMENSIONS J AND P IS 0.010.
UNDERSIDE OF LEADS WHERE
LEADS EXIT PACKAGE BODY.
DETERMINED WHERE CENTER
LEADS EXIT PACKAGE BODY AT
DATUM H.
DETERMINED AT SEATING PLANE,
DATUM T.
DETERMINED AT DATUM PLANE H.
DAMBAR PROTRUSIONS. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
LEAD WIDTH TO EXCEED 0.019.
Pin-out and Package Information
METAL
BASE
AC AC
E
SECTION AC-AC
VIEW AB
(D)
D2
C L
128X
DIM
X=L, M, OR N
C1
C2
D1
D2
R1
A1
B1
E1
J1
K1
P1
S1
V1
W
A
B
C
D
E
G
K
P
S
U
V
F
J
X
0.160
0.020
0.135
0.008
0.012
0.008
0.006
0.005
0.014
0.034
0.006
Packaging
G
MIN
1.100 BSC
0.550 BSC
1.100 BSC
0.550 BSC
0.025 BSC
0.950 BSC
0.475 BSC
0.010 BSC
0.950 BSC
0.475 BSC
0.013 REF
1.080 BSC
0.540 BSC
0.025 REF
1.080 BSC
0.540 BSC
E1
0
INCHES
PLATING
0.180
0.040
0.145
0.012
0.016
0.011
0.008
0.007
0.014
0.044
0.008
MAX
3-11
8