GT28F160C3TA90 Intel, GT28F160C3TA90 Datasheet - Page 66

• Manufacturer Part Number: GT28F160C3TA90
• Description: Flash Mem Parallel 3V/3.3V 16M-Bit 1M x 16 90ns 48-Pin UBGA
• Manufacturer: Intel

Specifications of GT28F160C3TA90

• Package: 48UBGA
• Density: 16 Mb
• Architecture: Sectored
• Block Organization: Asymmetrical
• Location Of Boot Block: Top
• Typical Operating Supply Voltage: 3|3.3 V
• Sector Size: 8KByte x 8|64KByte x 31
• Support Of Common Flash Interface: Yes
• Timing Type: Asynchronous
• Operating Temperature: -40 to 85 °C
• Interface Type: Parallel

Intel
66
Dimensions Table
Note: (1) Package dimensions are for reference only. These dimensions are estimates based
on die size, and are subject to change.
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
Figure 21. Easy BGA Package Drawing & Dimension
£
Advanced+ Boot Block Flash Memory (C3)
Ball A1
Corner
E
A2
B
C
D
E
F
G
H
A
1
Top View - Ball side down
A1
2
3
Side View
4
D
5
6
Symbol
A
A
7
[e]
S
S
A
D
N
b
E
Y
1
2
1
2
8
Millimeters
12.900
0.250
0.330
9.900
1.400
2.900
Min
A
A
B
C
D
G
H
E
F
10.000
13.000
0.780
0.430
1.000
1.500
3.000
Nom
8
64
Seating
Plane
Bottom View - Ball Side Up
7
10.100
13.100
6
1.200
0.530
0.100
1.600
3.100
Max
5
Notes
Note: Drawing not to scale
4
1
1
1
1
3
Inches
0.0098
0.0130
0.3898
0.5079
0.0551
0.1142
Min
2
1
Y
S1
0.0307
0.0169
0.3937
0.5118
0.0394
0.0591
0.1181
Nom
64
b
e
S2
Ball A1
Corner
Datasheet
0.0472
0.0209
0.3976
0.5157
0.0039
0.0630
0.1220
Max