TDA1519CTD/N3C,118 NXP Semiconductors, TDA1519CTD/N3C,118 Datasheet - Page 2

• Manufacturer Part Number: TDA1519CTD/N3C,118
• Description: IC AMP AUDIO PWR 22W MONO 20HSOP
• Manufacturer: NXP Semiconductors
• Type: Class Br

Specifications of TDA1519CTD/N3C,118

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm
• Voltage - Supply: 6 V ~ 17.5 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• Product: Class-AB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935284475118; TDA1519CTD/N3C-T; TDA1519CTD/N3C-T

Philips Semiconductors
FEATURES
ORDERING INFORMATION
2004 Jan 28
TYPE NUMBER
TDA1519C
TDA1519CSP
TDA1519CTD
TDA1519CTH
Requires very few external components for Bridge-Tied
Load (BTL) operation
Stereo or BTL application
High output power
Low offset voltage at output (important for BTL
applications)
Fixed gain
Good ripple rejection
Mute/standby switch
Load dump protection
AC and DC short-circuit safe to ground and V
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
No switch-on/switch-off plops
Protected against electrostatic discharge
Low thermal resistance
Identical inputs (inverting and non-inverting)
Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
22 W BTL or 2
stereo power amplifier
HSOP20
HSOP20
SMS9P
NAME
SIL9P
11 W
plastic single in-line power package; 9 leads
plastic surface mounted single in-line power package; 9 leads
plastic, heatsink small outline package; 20 leads
plastic, heatsink small outline package; 20 leads; low stand-off height
P
P
= 0 V)
2
DESCRIPTION
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
PACKAGE
Product specification
TDA1519C
SOT131-2
SOT354-1
SOT397-1
SOT418-3
VERSION