TDA1519C NXP Semiconductors, TDA1519C Datasheet

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TDA1519C

Manufacturer Part Number
TDA1519C
Description
Manufacturer
NXP Semiconductors
Datasheet

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Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
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TDA1519CCU
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Integrated
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TDA1519CSP
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TDA1519CT
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ERICSSON
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TDA1519CTH
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NXP
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Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
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TDA1519CTH
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MIC
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Product specification
Supersedes data of 2001 Aug 24
DATA SHEET
TDA1519C
22 W BTL or 2  11 W
stereo power amplifier
INTEGRATED CIRCUITS
2004 Jan 28

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TDA1519C Summary of contents

Page 1

... DATA SHEET TDA1519C 22 W BTL or 2  stereo power amplifier Product specification Supersedes data of 2001 Aug 24 INTEGRATED CIRCUITS 2004 Jan 28 ...

Page 2

... HSOP20 TDA1519CTH HSOP20 2004 Jan 28 GENERAL DESCRIPTION The TDA1519C is an integrated class-B dual output amplifier in a 9-lead plastic single in-line power package or 20-lead heatsink small outline package. For the TDA1519CTH (SOT418-3), the heatsink is positioned on top of the package, which allows an external heatsink to be mounted on top. The heatsink of the TDA1519CTD (SOT397-1) is facing the PCB, allowing the heatsink to be soldered onto the copper area of the PCB ...

Page 3

...      THD =  100 kHz 48 i   3 Product specification TDA1519C MIN. TYP. MAX. UNIT 14.4 17.5 V    A 0.1 100  A 40   ...

Page 4

... NXP Semiconductors 22 W BTL or 2  stereo power amplifier BLOCK DIAGRAM NINV RR INV The pin numbers refer to the TDA1519C and TDA1519CSP only, for TDA1519CTD and TDA1519CTH see Figs 3 and 4. 2004 Jan 28 mute switch 183 W 18 standby switch ...

Page 5

... NINV 2 GND1 RR 3 OUT1 4 TDA1519C GND2 5 TDA1519CSP 6 OUT2 M/SS 8 INV 9 mgr561 Fig.2 Pin configuration TDA1519C and TDA1519CSP. 2004 Jan 28 PIN TDA1519CTD TDA1519CTH n. OUT1 ...

Page 6

... NXP Semiconductors 22 W BTL or 2  stereo power amplifier FUNCTIONAL DESCRIPTION The TDA1519C contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/standby switch which has the following features: LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) ...

Page 7

... NXP Semiconductors 22 W BTL or 2  stereo power amplifier THERMAL CHARACTERISTICS SYMBOL PARAMETER R thermal resistance from junction to ambient; th(j-a) TDA1519C, TDA1519CTH and TDA1519CTD R thermal resistance from junction to case; th(j-c) TDA1519C, TDA1519CTH and TDA1519CTD DC CHARACTERISTICS = 25 C; measured in circuit of Fig.6; unless otherwise specified 14 ...

Page 8

... k S note 1 THD = 0.5 % THD = 13.2 V; note 1 P THD = 0.5 % THD = THD = 0 1 dB; with P o respect 1 dB; note 2  Product specification TDA1519C MIN. TYP. MAX.   5.5 6.0  7.5 8.5    0.1   45   ...

Page 9

... CONDITIONS on; notes 3 and 4 on; notes 3 and 5 mute; notes 3 and 6 standby; notes 3 and 6 note  k S mute; note V Product specification TDA1519C MIN. TYP. MAX.   34   48   48    ...

Page 10

... Fig.6 Stereo application diagram (TDA1519C). input reference internal voltage 1/2 V TDA1519C - signal power ground ground Fig.7 BTL application diagram (TDA1519C). 10 standby switch 100 µF 100 220 mgl493 standby switch 100 nF ...

Page 11

... Fig.8 Total quiescent current as a function of the supply voltage. BTL application  kHz. i 2004 Jan q(tot) (mA (W) 20 THD = 10 Fig.9 Output power as a function of the supply voltage. 11 Product specification TDA1519C mgr539 (V) P mgr540 (V) P ...

Page 12

... Fig.10 Total harmonic distortion as a function of the output power. BTL application  Fig.11 Total harmonic distortion as a function of the operating frequency. 2004 Jan 28 12 THD (%) 0.6 THD (%) 0.4 0 Product specification TDA1519C mgr541 (W) o mgu377 (Hz) i ...

Page 13

... Jan scale (1) ( 0.48 24.0 20.0 12.2 10 0.38 23.6 19.6 11.8 REFERENCES JEDEC JEITA 13 non-concave view B: mounting base side 3.4 17.2 2.1 6 2.54 3.1 16.5 1.8 EUROPEAN PROJECTION Product specification TDA1519C SOT131-2 ( 2.00 0.25 0.03 1.45 ISSUE DATE 99-12-17 03-03-12 ...

Page 14

... scale (1) ( 0.48 24.0 20.0 12.2 10 2.54 0.38 23.6 19.6 11.8 REFERENCES JEDEC JEITA heatsink θ 3.4 7.4 3.4 2.1 6 0.25 0.03 3.1 6.6 2.8 1.9 EUROPEAN PROJECTION Product specification TDA1519C SOT354-1 (1) θ 2.00 3° 0.15 1.45 0° ISSUE DATE 03-03-12 06-03-16 ...

Page 15

... 0.1 0.53 0.32 16.0 13.0 1.1 0.0 0.40 0.23 15.8 12.6 0.9 References JEDEC JEITA detail ( 11.1 6.2 2.9 14.5 1.1 1.5 1.27 10.9 5.8 2.5 13.9 0.8 1.4 European projection Product specification TDA1519C SOT397 θ θ ° 8 ° 2.5 0.25 0.25 0.1 2.0 sot397-1_po Issue date 03-07-23 10-10-21 ...

Page 16

... 0.32 16.0 13.0 1.1 11.1 6.2 2.9 0.23 15.8 12.6 0.9 10.9 5.8 2.5 REFERENCES JEDEC JEITA 16 Product specification detail 14.5 1.1 1.7 1.27 0.25 0.25 0.03 13.9 0.8 1.5 EUROPEAN PROJECTION TDA1519C SOT418 θ θ 8° 2.5 0.07 0° 2.0 ISSUE DATE 02-02-12 03-07-23 ...

Page 17

... The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe 17 Product specification TDA1519C 3 so called thick/large packages called small/thin packages. ...

Page 18

... WAVE REFLOW  suitable  (3) suitable not suitable  not suitable not suitable suitable (6) not suitable suitable suitable suitable (7)(8) not recommended suitable (9) not recommended suitable not suitable  (11) not suitable Product specification TDA1519C (2) DIPPING suitable       ...

Page 19

... Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 2004 Jan 28 19 Product specification TDA1519C ...

Page 20

... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 20 Product specification TDA1519C DEFINITION ...

Page 21

... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 21 Product specification TDA1519C ...

Page 22

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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