TDA1519C NXP Semiconductors, TDA1519C Datasheet - Page 2

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TDA1519C

Manufacturer Part Number
TDA1519C
Description
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
FEATURES
 Requires very few external components for Bridge-Tied
 Stereo or BTL application
 High output power
 Low offset voltage at output (important for BTL
 Fixed gain
 Good ripple rejection
 Mute/standby switch
 Load dump protection
 AC and DC short-circuit safe to ground and V
 Thermally protected
 Reverse polarity safe
 Capability to handle high energy on outputs (V
 No switch-on/switch-off plops
 Protected against electrostatic discharge
 Low thermal resistance
 Identical inputs (inverting and non-inverting)
 Pin compatible with TDA1519B (TDA1519C and
ORDERING INFORMATION
2004 Jan 28
TDA1519C
TDA1519CSP
TDA1519CTD
TDA1519CTH
TYPE NUMBER
Load (BTL) operation
applications)
TDA1519CSP).
22 W BTL or 2  11 W
stereo power amplifier
HSOP20
HSOP20
SMS9P
NAME
SIL9P
plastic single in-line power package; 9 leads
plastic surface mounted single in-line power package; 9 leads
plastic, heatsink small outline package; 20 leads
plastic, heatsink small outline package; 20 leads; low stand-off height
P
P
= 0 V)
2
DESCRIPTION
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
PACKAGE
Product specification
TDA1519C
SOT131-2
SOT354-1
SOT397-1
SOT418-3
VERSION