TDA1519C NXP Semiconductors, TDA1519C Datasheet - Page 19

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TDA1519C

Manufacturer Part Number
TDA1519C
Description
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
2004 Jan 28
22 W BTL or 2  11 W
stereo power amplifier
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
19
Product specification
TDA1519C