TDA1519C NXP Semiconductors, TDA1519C Datasheet - Page 14

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TDA1519C

Manufacturer Part Number
TDA1519C
Description
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
2004 Jan 28
SMS9P: plastic surface-mounted single in-line power package; 9 leads
22 W BTL or 2  11 W
stereo power amplifier
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT354-1
4.9
4.2
A
non-concave
0.35
0.05
E h
A 1
x
4.6
4.4
A 2
9
Z
y
0.25
IEC
A 3
0.75
0.60
b p
e
0.48
0.38
c
D h
D
d
JEDEC
24.0
23.6
D
(1)
20.0
19.6
REFERENCES
d
b
p
0
D h
10
w
12.2
11.8
M
E
JEITA
1
scale
(1)
14
heatsink
5
2.54
j
e
10 mm
E h
6
3.4
3.1
j
L p
7.4
6.6
L
A 1
θ
c
3.4
2.8
L p
Q
PROJECTION
A 2
A
(A 3 )
2.1
1.9
EUROPEAN
Q
0.25
w
E
L
0.03
heatsink
x
Product specification
TDA1519C
0.15
y
ISSUE DATE
03-03-12
06-03-16
2.00
1.45
Z
SOT354-1
(1)
θ