TDA1519CU NXP Semiconductors, TDA1519CU Datasheet
TDA1519CU
Specifications of TDA1519CU
Related parts for TDA1519CU
TDA1519CU Summary of contents
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DATA SHEET TDA1519C 22 W BTL or 2 stereo power amplifier Product specification Supersedes data of 2001 Aug 24 INTEGRATED CIRCUITS 2004 Jan 28 ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier FEATURES Requires very few external components for Bridge-Tied Load (BTL) operation Stereo or BTL application High output power Low offset voltage at output (important for BTL applications) Fixed gain ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier QUICK REFERENCE DATA SYMBOL PARAMETER Supply V supply voltage P I repetitive peak output current ORM I total quiescent current q(tot) I standby current stb I switch-on current sw(on) Inputs Z input impedance i Stereo application P output power o ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier BLOCK DIAGRAM NINV RR INV The pin numbers refer to the TDA1519C and TDA1519CSP only, for TDA1519CTD and TDA1519CTH see Figs 3 and 4. 2004 Jan 28 mute switch 183 W 18 standby switch × mute reference voltage 18 ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier PINNING SYMBOL TDA1519C; TDA1519CSP NINV 1 GND1 OUT1 4 GND2 5 OUT2 M/SS 8 INV 9 n. and and not connected 1 NINV 2 GND1 RR 3 OUT1 4 TDA1519C GND2 5 TDA1519CSP 6 OUT2 M/SS 8 INV 9 mgr561 Fig.2 Pin configuration TDA1519C and TDA1519CSP ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier FUNCTIONAL DESCRIPTION The TDA1519C contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/standby switch which has the following features: LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier THERMAL CHARACTERISTICS SYMBOL PARAMETER R thermal resistance from junction to ambient; th(j-a) TDA1519C, TDA1519CTH and TDA1519CTD R thermal resistance from junction to case; th(j-c) TDA1519C, TDA1519CTH and TDA1519CTD DC CHARACTERISTICS = 25 C; measured in circuit of Fig.6; unless otherwise specified. ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier AC CHARACTERISTICS = 4 kHz 14 SYMBOL PARAMETER Stereo application (see Fig.6) P output power o THD total harmonic distortion f low frequency roll-off ro(l) f high frequency roll-off ro(h) G closed-loop voltage gain v(cl) SVRR supply voltage ripple rejection ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier SYMBOL PARAMETER SVRR supply voltage ripple rejection Z input impedance i V noise output voltage (RMS value) n(o)(rms) Notes 1. Output power is measured directly at the output pins of the device. 2. Frequency response externally fixed. ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier APPLICATION INFORMATION 220 nF non-inverting input 220 nF non-inverting input to pin 9 2004 Jan 28 input reference internal voltage 1/2 V TDA1519C - signal power ground ground 1000 µF Fig.6 Stereo application diagram (TDA1519C). input reference internal voltage ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier Fig.8 Total quiescent current as a function of the supply voltage. BTL application kHz. i 2004 Jan q(tot) (mA (W) 20 THD = 10 Fig.9 Output power as a function of the supply voltage. 11 Product specification TDA1519C mgr539 16 20 ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier BTL application kHz. i Fig.10 Total harmonic distortion as a function of the output power. BTL application Fig.11 Total harmonic distortion as a function of the operating frequency. 2004 Jan 28 12 THD (%) 0.6 THD (%) ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads DIMENSIONS (mm are the original dimensions UNIT max. max. 4.6 0. 1.1 4.4 0.60 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier SMS9P: plastic surface-mounted single in-line power package; 9 leads y non-concave DIMENSIONS (mm are the original dimensions) UNIT 4.9 0.35 4.6 0.75 mm 0.25 4.2 0.05 4.4 0.60 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier HSOP20: plastic, heatsink small outline package; 20 leads pin 1 index Dimensions (1) Unit max 0.3 3.5 mm nom 3.6 0.35 0.1 3.2 min Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. Outline ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions UNIT max. +0.08 0.53 3.5 mm 3.5 0.35 −0.04 0.40 3.2 Notes 1. Limits per individual lead. ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). ...
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... Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your NXP Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “ ...
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... NXP Semiconductors 22 W BTL or 2 stereo power amplifier 8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...