TDA1519CU NXP Semiconductors, TDA1519CU Datasheet - Page 2

• Manufacturer Part Number: TDA1519CU
• Description: Audio Amplifiers 22W BTL 2x11W PWR AMP
• Manufacturer: NXP Semiconductors

Specifications of TDA1519CU

• Product: Class-B
• Output Power: 22 W
• Available Set Gain: 46 dB
• Thd Plus Noise: 0.1 %
• Operating Supply Voltage: 14.4 V
• Supply Current: 40 mA
• Maximum Power Dissipation: 25000 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential or Single
• Minimum Operating Temperature: - 55 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 17.5 V
• Supply Voltage (min): 6 V
• Output Type: 1-Channel Mono or 2-Channel Stereo
• Package / Case: SOT-131-2
• Other names: TDA1519C/N3,112

NXP Semiconductors
FEATURES
 Requires very few external components for Bridge-Tied
 Stereo or BTL application
 High output power
 Low offset voltage at output (important for BTL
 Fixed gain
 Good ripple rejection
 Mute/standby switch
 Load dump protection
 AC and DC short-circuit safe to ground and V
 Thermally protected
 Reverse polarity safe
 Capability to handle high energy on outputs (V
 No switch-on/switch-off plops
 Protected against electrostatic discharge
 Low thermal resistance
 Identical inputs (inverting and non-inverting)
 Pin compatible with TDA1519B (TDA1519C and
ORDERING INFORMATION
2004 Jan 28
TDA1519C
TDA1519CSP
TDA1519CTD
TDA1519CTH
TYPE NUMBER
Load (BTL) operation
applications)
TDA1519CSP).
22 W BTL or 2  11 W
stereo power amplifier
HSOP20
HSOP20
SMS9P
NAME
SIL9P
plastic single in-line power package; 9 leads
plastic surface mounted single in-line power package; 9 leads
plastic, heatsink small outline package; 20 leads
plastic, heatsink small outline package; 20 leads; low stand-off height
P
P
= 0 V)
2
DESCRIPTION
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
PACKAGE
Product specification
TDA1519C
SOT131-2
SOT354-1
SOT397-1
SOT418-3
VERSION