HFA1135IBZ96 Intersil, HFA1135IBZ96 Datasheet - Page 2

• Manufacturer Part Number: HFA1135IBZ96
• Description: IC OPAMP CFA 360MHZ LP 8-SOIC
• Manufacturer: Intersil

Specifications of HFA1135IBZ96

• Applications: Current Feedback
• Number Of Circuits: 1
• -3db Bandwidth: 360MHz
• Slew Rate: 1530 V/µs
• Current - Supply: 6.9mA
• Current - Output / Channel: 60mA
• Voltage - Supply, Single/dual (±): ±4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Absolute Maximum Ratings
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V
Output Current (Note 1) . . . . . . . . . . . . . . . . .Short Circuit Protected
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>600V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
INPUT CHARACTERISTICS
Input Offset Voltage
Average Input Offset Voltage Drift
Input Offset Voltage
Common-Mode Rejection Ratio
Input Offset Voltage
Power Supply Rejection Ratio
Non-Inverting Input Bias Current
Non-Inverting Input Bias Current Drift
Non-Inverting Input Bias Current
Power Supply Sensitivity
Non-Inverting Input Resistance
Inverting Input Bias Current
Inverting Input Bias Current Drift
Inverting Input Bias Current
Common-Mode Sensitivity
Inverting Input Bias Current
Power Supply Sensitivity
Inverting Input Resistance
Input Capacitance (Either Input)
1. θ
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
PARAMETER
2
V
SUPPLY
T
A
= 25
60mA ≤ 50% Duty Cycle
= ±5V, A
o
C
30mA Continuous
V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
∆V
= +1, R
o
TEST CONDITIONS
CM
CM
CM
PS
PS
PS
PS
PS
PS
CM
CM
CM
CM
CM
CM
PS
PS
PS
C to 85
SUPPLY
= ±1.8V
= ±1.8V
= ±1.2V
= ±1.8V
= ±1.8V
= ±1.2V
= ±1.8V
= ±1.8V
= ±1.2V
= ±1.8V
= ±1.8V
= ±1.2V
= ±1.8V
= ±1.8V
= ±1.2V
= ±1.8V
= ±1.8V
= ±1.2V
F
= 510Ω (Note 3), R
o
HFA1135
C
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature (Die Only) . . . . . . . . . . . . . . . .175
Maximum Junction Temperature (Plastic Package) . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
(NOTE 2)
LEVEL
L
TEST
= 100Ω, Unless Otherwise Specified
A
A
B
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
C
C
TEMP.
(
Full
Full
Full
Full
Full
Full
-40
-40
-40
-40
-40
-40
o
25
25
25
85
25
85
25
85
25
85
25
25
85
25
85
25
25
C)
MIN
0.8
0.5
0.5
47
45
45
50
47
47
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP
0.5
0.8
0.8
1.3
1.3
0.1
1.6
50
48
48
54
50
50
10
60
40
2
3
1
6
5
2
3
3
4
4
2
4
4
MAX
200
10
15
25
60
5
8
1
3
3
4
8
6
8
8
5
8
8
-
-
-
-
-
-
-
-
-
-
-
o
θ
C to 150
JA
UNITS
µV/
nA/
nA/
µA/V
µA/V
µA/V
µA/V
µA/V
µA/V
µA/V
µA/V
µA/V
MΩ
MΩ
MΩ
mV
mV
165
dB
dB
dB
dB
dB
dB
µA
µA
µA
µA
pF
(
Ω
o
o
o
o
C/W)
C
C
C
o
o
o
o
C
C
C
C