ISL59483IRZ-T13 Intersil, ISL59483IRZ-T13 Datasheet - Page 11

• Manufacturer Part Number: ISL59483IRZ-T13
• Description: IC MUX AMP DUAL 500MHZ 48-QFN
• Manufacturer: Intersil

Specifications of ISL59483IRZ-T13

• Applications: 4:1 Multiplexer-Amplifier
• Number Of Circuits: 3
• -3db Bandwidth: 500MHz
• Slew Rate: 1600 V/µs
• Current - Supply: 92mA
• Current - Output / Channel: 125mA
• Mounting Type: Surface Mount
• Package / Case: 48-VQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Typical Performance Curves
FIGURE 38. MUX 1: HIZ TRANSIENT RESPONSE V
FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 36. MUX 1: HIZ SWITCHING GLITCH V
0
0
0
0
HIZ
50Ω
TERM.
HIZ
50Ω
TERM.
6
5
4
3
2
1
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
TEMPERATURE
4.34W
25
AMBIENT TEMPERATURE (°C)
50
V
V
10ns/DIV
OUT
OUT
10ns/DIV
11
θ
JA
A, B, C
QFN48
A, B, C
75
=+23°C/
85
100
V
S
= ±5V, R
125
V
IN
V
IN
IN
IN
= 0V
=1V
= 0V
150
L
= 1V
= 500Ω to GND, T
ISL59483
A
= +25°C, unless otherwise specified. (Continued)
FIGURE 41. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 39. MUX 2: HIZ TRANSIENT RESPONSE V
FIGURE 37. MUX 2: HIZ SWITCHING GLITCH V
0
0
0
0
HIZ
50Ω
TERM.
HIZ
50Ω
TERM.
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
870mW
TEMPERATURE
25
AMBIENT TEMPERATURE (°C)
50
20ns/DIV
V
20ns/DIV
OUT
V
θ
JA
OUT
75
QFN48
=+115°C/
A, B, C
85
A, B, C
100
125
V
IN
IN
V
= 0V
IN
May 21, 2007
IN
= 0V
150
= 1V
FN6394.2
= 1V